Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Alexandra L. Zimpeck"'
Autor:
Fábio G.R.G. da Silva, Rafael N.M. Oliveira, Alexandra L. Zimpeck, Cristina Meinhardt, Ricardo Reis
Publikováno v:
Integration. 87:137-146
Publikováno v:
2021 IEEE Asia Pacific Conference on Circuit and Systems (APCCAS).
Autor:
Bernardo Borges Sandoval, Leonardo Heitich Brendler, Alexandra L. Zimpeck, Fernanda L. Kastensmidt, Ricardo Reis, Cristina Meinhardt
Publikováno v:
2021 IEEE 22nd Latin American Test Symposium (LATS).
Publikováno v:
ISCAS
Advanced technologies introduce new challenges as higher process variability impact and tight power constraints, mainly for IoT applications. Schmitt Trigger inverters are traditionally used for noise immunity enhancement due to their hysteresis char
Publikováno v:
LATS
The evolution of integrated circuits, alongside the technology scaling, has made them more susceptible to the radiation effects, as well presenting an increasing manufacturing process variability. These challenges can lead to circuits operating outsi
Autor:
Cristina Meinhardt, Ricardo Reis, Leonardo H. Brendler, Leonardo E. Moraes, Alexandra L. Zimpeck
Publikováno v:
LATS
The mitigation of soft errors should be considered in all design abstraction levels, from a high level to the physical one. This tutorial is focused on the circuit and physical design levels. Transistor reordering or transistor arrangements is an imp
Publikováno v:
IEEE Transactions on Circuits and Systems I: Regular Papers
IEEE Transactions on Circuits and Systems I: Regular Papers, IEEE, 2020, 67 (2), pp.553-564. ⟨10.1109/TCSI.2019.2927374⟩
IEEE Transactions on Circuits and Systems I: Regular Papers, IEEE, 2020, 67 (2), pp.553-564. ⟨10.1109/TCSI.2019.2927374⟩
International audience; Transistor arrangement influences the performance of logic cells. Complex logic cells can be used to minimize area, delay, and power. However, with the increasing relevance of nanometer challenges such as process variability a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::de2a24ad43a28477a1389257ee582580
https://hal.archives-ouvertes.fr/hal-02860070
https://hal.archives-ouvertes.fr/hal-02860070
Publikováno v:
Microelectronics Reliability. :116-121
The aggressive technology and voltage scaling which modern digital circuits are facing introduce a higher influence in metrics, as performance and power consumption, due to process variability. To mitigate that, novel techniques are proposed and test
Autor:
Laurent Artola, Cristina Meinhardt, Guillaume Hubert, Ricardo Reis, Fernanda Lima Kastensmidt, Alexandra L. Zimpeck
Publikováno v:
Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2018, pp.111-115. ⟨10.1016/j.microrel.2018.06.090⟩
Microelectronics Reliability, Elsevier, 2018, pp.111-115. ⟨10.1016/j.microrel.2018.06.090⟩
International audience; This paper evaluates a set of complex cells with different transistor arrangements that implement the same logic function. These cells were evaluated under nominal conditions and with gate variability at layout level. The purp
Publikováno v:
IFIP Advances in Information and Communication Technology
27th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC)
27th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC), Oct 2019, Cusco, Peru. pp.89-113, ⟨10.1007/978-3-030-53273-4_5⟩
IFIP Advances in Information and Communication Technology ISBN: 9783030532727
VLSI-SoC (Selected Papers)
27th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC)
27th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC), Oct 2019, Cusco, Peru. pp.89-113, ⟨10.1007/978-3-030-53273-4_5⟩
IFIP Advances in Information and Communication Technology ISBN: 9783030532727
VLSI-SoC (Selected Papers)
International audience; Challenges were introduced in integrated circuits design due to the technology scaling. The evolution of integrated circuits has made them more susceptible to the radiation effects, besides increasing the manufacturing process
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::aeed58e57148428f96c0720326b1d152
https://hal.inria.fr/hal-03476601
https://hal.inria.fr/hal-03476601