Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Alexandr Otahal"'
Autor:
Larisa Chmelikova, Peter Fecko, Jiri Chmelik, Josef Skacel, Alexandr Otahal, Zdenka Fohlerova
Publikováno v:
Applied Materials Today. 31:101736
Autor:
Ondrej Bilek, Zdenka Fohlerova, Kristyna Smerkova, Tatiana Fialova, Alexandr Otahal, Vojtech Adam
Publikováno v:
RSC Advances. 2020, vol. 10, issue 72, p. 1-10.
Enhanced antibacterial properties of nanomaterials such as TiO2 nanotubes (TNTs) and silver nanoparticles (AgNPs) have attracted much attention in biomedicine and industry. The antibacterial properties of nanoparticles depend, among others, on the fu
Autor:
Ondřej Man, Alexandr Knápek, Pavel Škarvada, Alexandr Otahal, Milan Matějka, Zuzana Pokorná, Tomáš Fořt, Filip Mika, Pavel Čudek, Lucie Šimonová, T. Kralik
Publikováno v:
Nanomaterials. 2021, vol. 11, issue 9, p. 1-14.
Nanomaterials
Volume 11
Issue 9
Nanomaterials, Vol 11, Iss 2443, p 2443 (2021)
Nanomaterials
Volume 11
Issue 9
Nanomaterials, Vol 11, Iss 2443, p 2443 (2021)
This paper focuses on the research and development of a suitable method for creating a selective emitter for the visible and near-infrared region to be able to work optimally together with silicon photovoltaic cells in a thermophotovoltaic system. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e02cf5599fb8e47b3b25e05a5808ae06
https://hdl.handle.net/11012/201642
https://hdl.handle.net/11012/201642
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding a
Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This paper is focused on evaluation of influence of flux residues encapsulated under underfill of BGA package on failure, area size and circularity of solder balls interconnection after rework and repair process. The main goal of the work was to find
Autor:
Alexandr Otahal, Ivan Szendiuch
Publikováno v:
Journal of Electrical Engineering. 2018, vol. 69, issue 4, p. 305-310.
This paper deals with the research of an intermetallic layer of SAC305 solder balls soldered from three directions of the heat flow in the ball-attach process for BGA package. From the point of view of the heat flow direction, the samples were solder
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al$_{2}O_{3}$). The electrical current load concerning the width o
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and co
Autor:
Alexandr Otahal, Hanliang Zhu, Jaromir Hubalek, Pavel Podesva, Levent Yobas, Sheng Ni, Pavel Neuzil, Zdenka Fohlerova
Publikováno v:
Scientific Reports
Scientific Reports, Vol 10, Iss 1, Pp 1-9 (2020)
Scientific Reports. 2020, vol. 10, issue 1, p. 1-9.
Scientific Reports, Vol 10, Iss 1, Pp 1-9 (2020)
Scientific Reports. 2020, vol. 10, issue 1, p. 1-9.
Optofluidic devices combining optics and microfluidics have recently attracted attention for biomolecular analysis due to their high detection sensitivity. Here, we show a silicon chip with tubular microchannels buried inside the substrate featuring
Publikováno v:
Periodica Polytechnica Electrical Engineering and Computer Science. 60:217-222
This paper is dealing with an in-depth verification of innovated activation methods, where the phase of surface treatment involves solvent with oxides of carbon as the core chemistry. The overall impact of solvent on through-hole copper plating proce