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pro vyhledávání: '"Alexander Timothy Bean"'
Publikováno v:
SPIE Proceedings.
As the semiconductor industry continues to strive towards high volume manufacturing for EUV, flatness specifications for photomasks have decreased to below 10nm for 2018 production, however the current champion masks being produced report P-V flatnes
Publikováno v:
SPIE Proceedings.
Due to the impact on image placement and overlay errors inherent in all reflective lithography systems, EUV reticles will need to adhere to flatness specifications below 10nm for 2018 production. These single value metrics are near impossible to meet