Zobrazeno 1 - 1
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pro vyhledávání: '"Alexander Sarvadi"'
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of addit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7608498173920387fa30ca62250cba40
https://doi.org/10.1115/ipack2022-97476
https://doi.org/10.1115/ipack2022-97476
