Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Alexander Flacker"'
Autor:
Alexander Flacker, Cristina B. Adamo, Salomão M. da Silva Junior, Michele O. Silva, Melissa Mederos, Ricardo C. Teixeira
Publikováno v:
Química Nova, Vol 46, Iss 9, Pp 854-859 (2023)
The morphology and adhesion strength of the autocatalytic electroless nickel phosphorus (Ni-P) film, deposited at 40 ºC on polished alumina (Al2O3 99.6%) substrate, pretreated by sulfur/nitric solution, sensitizing with acid stannous chloride and ac
Externí odkaz:
https://doaj.org/article/5bae68f0d26f42e28f47e1321fd90b04
Publikováno v:
Journal of Integrated Circuits and Systems. 15:1-4
A Multichip Module (MCM) is a structure consisting of several ICs (typically bare chips) interconnected on a common supporting substrate and packaged as a single device. In this packaging technology, gold (Au) thin films are used as interconnection t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::834dc12c21072bd56445603c83fc3e5a
https://doi.org/10.29292/jics.v15i2.145
https://doi.org/10.29292/jics.v15i2.145
Publikováno v:
Journal of the Brazilian Chemical Society.
In this paper, a pre-treatment process for electroless copper (Cu) deposition on the polished alumina (Al2O3) 99.9% and the behavior of Cu plating by electroless process after Al2O3 surface treatment were explored. Our work was carried out by changin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7fbef2dadb28726b09577ea3d4a1e5fb
https://doi.org/10.21577/0103-5053.20220017
https://doi.org/10.21577/0103-5053.20220017
Publikováno v:
Scopus
Repositório Institucional da UNESP
Universidade Estadual Paulista (UNESP)
instacron:UNESP
Repositório Institucional da UNESP
Universidade Estadual Paulista (UNESP)
instacron:UNESP
An experimental investigation comparing the properties of plasma jets in dielectric barrier discharge (DBD) configurations using a powered electrode with and without a dielectric barrier, while keeping a second dielectric barrier over the grounded el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8f4ec17b16c989b5909bac600cbbacda
Autor:
Elson Longo, Aline Macedo Faria, Talita Mazon, Elisa B. M. I. Peixoto, Cristina B. Adamo, Alexander Flacker
Publikováno v:
Scientific Reports
Scientific Reports, Vol 10, Iss 1, Pp 1-1 (2020)
Scientific Reports, Vol 10, Iss 1, Pp 1-1 (2020)
This work discusses the parameters and characteristics required on the development of a scalable and reliable electrochemical sensor board for detecting 8-hydroxy-2'-deoxyguanosine (8-OHdG), an oxidative stress biomarker for diabetic nephropathy, can
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cd7f972c8dcd05a12b1ee11a3896d13e
http://europepmc.org/articles/PMC7046669
http://europepmc.org/articles/PMC7046669
Autor:
Sergio O. Castillo, R. C. Teixeira, Andre F. Ponchet, Rafael C. Medeiros, Cristina B. Adamo, Alexander Flacker
Publikováno v:
2018 33rd Symposium on Microelectronics Technology and Devices (SBMicro).
Current trend on electronics seek devices with more functionalities integrated on a smaller footprint. Multi-chip module technology based on thin films deposition (MCM-D) is one enabling technology that can achieve such demand. In this paper authors
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1bcfade7c5243adf468e570c5cce9f8
https://doi.org/10.1109/sbmicro.2018.8511562
https://doi.org/10.1109/sbmicro.2018.8511562
Autor:
Celio A. Finardi, Alexander Flacker, Andre F. Ponchet, Roberto R. Panepucci, Cristina B. Adamo, R. C. Teixeira
Publikováno v:
2016 31st Symposium on Microelectronics Technology and Devices (SBMicro).
The paper presents a technological solution for high frequency packaging platform to at least 40 GHz. This approach is based on soft substrate processing. We present results of high frequency packaging of important building blocks, such as bias-T, tr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73832b8a0cd6a0d0f39efd88695af89b
https://doi.org/10.1109/sbmicro.2016.7731349
https://doi.org/10.1109/sbmicro.2016.7731349
Autor:
Eurípedes Guilherme de Oliveira Nóbrega, Alexander Flacker, Camila D. M. Campos, Stanislav A. Moshkalev
Publikováno v:
Thin Solid Films. 520:4871-4874
The results of an investigation of thin Ni and CoNiMnP films deposited by electroplating over polyurethane-acrylate flexible substrates are presented. To improve magnetic properties of the films, an electroplating process was carried out with assista
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a1116bed798f049bf7ffdbdf1b776b8
https://doi.org/10.1016/j.tsf.2012.03.022
https://doi.org/10.1016/j.tsf.2012.03.022
Autor:
Camila D. M. Campos, Stanislav A. Moshkalev, Eurípedes Guilherme de Oliveira Nóbrega, Alexander Flacker, Alfredo R. Vaz
Publikováno v:
ECS Transactions. 39:431-437
The influence of a magnetic field on electrodeposition of nickel films over polymeric substrates which renders flexible membranes with permanent magnet layers is studied. Samples of membranes with nickel deposited by electroplating in presence and ab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::724afa469a2d4583ccff450048c86ecb
https://doi.org/10.1149/1.3615223
https://doi.org/10.1149/1.3615223
Publikováno v:
ECS Transactions. 23:327-334
This paper describes a new fabrication technique of planar metallic microstructures with geometries equal or smaller than 15m on 96% alumina substrates. This technique is based on both: chemical and electrolytic deposition. In order to evaluate this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1369c9df75256bcd4b65c5e3a740092c
https://doi.org/10.1149/1.3183736
https://doi.org/10.1149/1.3183736