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Autor:
Michael R. Bynum, Lakshman Krishnamurthy, Alexander Essaian, Torrey W. Frank, Vijay K. Nair, Swan Johanna M
Publikováno v:
RWS
This paper discusses design, fabrication and characterization of a 3D stacked small form factor (SFF) system-in-packages (SiPs) suitable for wearable electronics systems. In order to achieve very small size SiP, two SFF multi-chip packages were desig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b97bbeccb54ab7970f2541180c33df7e
https://doi.org/10.1109/rws.2017.7885959
https://doi.org/10.1109/rws.2017.7885959
