Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Alexander Dabek"'
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::361377d58f986ae6eede370941d3a1d1
https://doi.org/10.1109/estc.2014.6962767
https://doi.org/10.1109/estc.2014.6962767
Publikováno v:
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology.
Ball Grid Array (BGA) packages are increasingly adopted in high reliability electronics equipment. The main reliability concern is that lead-free (Pb-free) packaged BGAs bring the risks of failures due to tin whiskers growth phenomena associated with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::59943711702cf637a9a3e6df3662c093
https://doi.org/10.1109/isse.2014.6887559
https://doi.org/10.1109/isse.2014.6887559
Publikováno v:
Proceedings of the 36th International Spring Seminar on Electronics Technology.
This paper details a sub-modelling approach to the thermo-mechanical characterisation of flip-chip Ball Grid Array (fcBGA) behaviour during PCB reflow assembly. The main advances in the outlined modelling methodology relate to: (1) accurate assessmen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::012458e480aee72125a3094cd58eaa04
https://doi.org/10.1109/isse.2013.6648252
https://doi.org/10.1109/isse.2013.6648252
Autor:
Joacim Haglund, Ralf Buestrich, Jens Neumann-Rodekirch, Oliver Rösch, L. Cergel, Gale Michael T, Mats Robertsson, Alexander Dabek, Annika Andersson, Frank Kahlenberg, Daniel Lambert, Michael Popall, Blau Gerd
Publikováno v:
MRS Proceedings. 628
Photopatternable hybrid inorganic-organic polymers with negative resist behaviour have been developed and tested for evaluation in optical and electrical interconnection technology. They are composed of inorganic oxidic structures cross-linked or sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efb6672d5e7c7b5aa201fa85ffc78260
https://doi.org/10.1557/proc-628-cc9.4
https://doi.org/10.1557/proc-628-cc9.4
Conference
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