Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Alexander Capanzana"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3741292b8e85a956824cad34885d5bad
https://doi.org/10.1109/ectc51906.2022.00198
https://doi.org/10.1109/ectc51906.2022.00198
Publikováno v:
2021 IEEE 21st International Conference on Nanotechnology (NANO).
We set out to affirm the high reliability of a novel nanocopper-based highly conductive bond agent that allows the formulation of an entire suite of Tunable Engineered Copper (TEC) pastes and inks suited for a wide range of SMT die-bonding and packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68143738888c74a9f23205f7c4e076ff
https://doi.org/10.1109/nano51122.2021.9514296
https://doi.org/10.1109/nano51122.2021.9514296