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Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Nowadays microelectronic packaging has become a billion dollar business. Due to the increased material and production costs per package, manufacturing yield loss in this state-of-art business is expected to be at a bare minimum which is tough to pers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12e7fa6b7e78d241f43d8062edc9ecc1
https://doi.org/10.1115/ipack2018-8254
https://doi.org/10.1115/ipack2018-8254
