Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Alex Radisic"'
Publikováno v:
Nanomaterials, Vol 7, Iss 6, p 126 (2017)
In this work, we present the electrochemical deposition of manganese dioxide (MnO2) thin films on carbon-coated TiN/Si micro-pillars. The carbon buffer layer, grown by plasma enhanced chemical vapor deposition (PECVD), is used as a protective coating
Externí odkaz:
https://doaj.org/article/ba8120feb980472dae7e5918566b26b9
Publikováno v:
APL Materials, Vol 2, Iss 2, Pp 022101-022101-9 (2014)
We describe a technique for patterning clusters of metal using electrochemical deposition. By operating an electrochemical cell in the transmission electron microscope, we deposit Cu on Au under potentiostatic conditions. For acidified copper sulphat
Externí odkaz:
https://doaj.org/article/48f39eebe17b41499efb84bc988590e3
Autor:
Lin Hou, Alex Radisic, Gerald Beyer, Eric Beyne, Vladimir Cherman, Ingrid De Wolf, Pieter Bex, Jaber Derakhshandeh, Jeroen De Coster, Kenneth June Rebibis, Mia Honore
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
In this work, an in-situ resistance measurement method is proposed to investigate the interfacial solid state reaction of alternative metallurgies, such as Ni and Cu/Ni as UBM materials, with Sn solders. The electrical properties of formed IMC phases
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0dd96c8d57ad48245679f7b578b82d9
https://doi.org/10.1109/estc.2018.8546500
https://doi.org/10.1109/estc.2018.8546500
Publikováno v:
Nanomaterials; Volume 7; Issue 6; Pages: 126
Nanomaterials, Vol 7, Iss 6, p 126 (2017)
Nanomaterials
Nanomaterials, Vol 7, Iss 6, p 126 (2017)
Nanomaterials
In this work, we present the electrochemical deposition of manganese dioxide (MnO₂) thin films on carbon-coated TiN/Si micro-pillars. The carbon buffer layer, grown by plasma enhanced chemical vapor deposition (PECVD), is used as a protective coati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::40fa1d269419e128284dd0a89cc88ff6
https://lirias.kuleuven.be/handle/123456789/608521
https://lirias.kuleuven.be/handle/123456789/608521
Publikováno v:
Microelectronic Engineering. 120:251-256
In this paper we report on fabrication of Platinum (Pt) interconnects on the flexible bio-compatible substrates, having in mind possible applications in implantable medical devices. We aim to replace physical vapor deposition methods (PVD) with plati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c36d09b2e662fa424e7da255adec7c2b
https://doi.org/10.1016/j.mee.2013.07.004
https://doi.org/10.1016/j.mee.2013.07.004
Publikováno v:
ECS Transactions. 58:3-15
Among all the Ru-based substrates, mixed-phase RuTa liners grown by physical vapor deposition have been explored as potential directly-platable diffusion barrier candidates. In order to understand the full-wafer copper direct plating process that occ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cf7546ef802fd71b5896d4f2897a491
https://doi.org/10.1149/05817.0003ecst
https://doi.org/10.1149/05817.0003ecst
Autor:
Peter Leunissen, Shoso Shingubara, Yann Civale, Alex Radisic, Harold Philipsen, Fumihiro Inoue, Silvia Armini
Publikováno v:
Journal of The Electrochemical Society. 159:D437-D441
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eab601a470d38750471e73b9d9493a8
https://doi.org/10.1149/2.070207jes
https://doi.org/10.1149/2.070207jes
Autor:
Hugo Bender, Alex Radisic, Chris Drijbooms, Wouter Ruythooren, Harold Philipsen, S. Rodet, Ole Lühn, Zaid El-Mekki, M. Honore, Silvia Armini
Publikováno v:
Microelectronic Engineering. 88:701-704
In this paper we report on Cu plating of through-silicon-vias (TSV-s) using in-house made acidic Cu bath with model additives (SPS, PEG, and JGB). Although the model additives might not be as potent as commercial additives, they have been studied in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4057f58d2bcbea2e79c61d67e1e32953
https://doi.org/10.1016/j.mee.2010.06.030
https://doi.org/10.1016/j.mee.2010.06.030
Publikováno v:
Journal of Materials Science. 47:6497-6504
Different milling strategies for the structural characterization of through silicon vias on silicon wafers and in stacked dies are examined. For investigation of the filling quality, the most appropriate analysis technique is dual beam focused ion be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3ebf2f7b860c75865e9bee48991c5b2
https://doi.org/10.1007/s10853-010-5144-6
https://doi.org/10.1007/s10853-010-5144-6
Autor:
George Bryce, Annemie Van Ammel, Yann Civale, Silvia Armini, Tanya Atanasova, Alain Moussa, Alex Radisic, Wouter Ruythooren, Kris Vanstreels, Christopher J. Wilson, Alexis Franquet, Zaid El-Mekki
Publikováno v:
ECS Transactions. 28:77-87
The results of a wet alkaline seed deposition process directly on barrier layers or thin adhesion promoter films, such as CVD Co are presented. This solution has been successfully used for copper plating on blanket and patterned Though Silicon Via (T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea628f64e5895bfca0fe4228751dd7a2
https://doi.org/10.1149/1.3502446
https://doi.org/10.1149/1.3502446