Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Alex Kalnitsky"'
Autor:
Alan Roth, Tze-Chiang Huang, Eric Soenen, Charlie Zhou, Sheng-Yao Yang, Mei Wong, Stefan Rusu, Frank Lee, Kai-Yuan Ting, Alex Kalnitsky, Min-Jer Wang, Mark Chen, Ying-Chih Hsu, Kevin Zhang, Paul Ranucci, Ting-Yu Yeh, Hung-Chih Lin, C. H. Kuo, Alvin Leng Sun Loke, J.R. Chu
Publikováno v:
2020 IEEE Symposium on VLSI Technology.
We demonstrate two heterogeneous solutions to improve power delivery to High-Performance Computing (HPC) processors. The scalable HPC vehicle integrates two 7nm CMOS processor chiplets, each with four ARM® Cortex®-A72 cores, that are mounted on a C
Autor:
Gabriel Petrus Lansbergen, Ming-Cheng Lin, Man-Ho Kwan, C.H. Tsai, H. C. Tuan, Cheng-Pao Wu, Haw-Yun Wu, Alex Kalnitsky, J. L. Yu, Wen-Che Chang
Publikováno v:
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD).
To accelerate GaN adoption, beyond-JEDEC system-level reliability should be done to prove the robustness of GaN in applications. In this paper, a new hard switching test vehicle (half-bridge RC load) was proposed & demonstrated to achieve system-like
Autor:
C.N. Ke, K.S. Yuan, S. B. Yang, C.C. Hsu, Harry Ku, K. C. Liu, Kirin Wang, C. C. Kuo, C. H. Kuo, Alex Kalnitsky, Marvin Liao, Chen Yi-Sheng, Ching-Fang Chen, G. C. Huang, Chang Grace, Hsin-Ting Huang
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Inductor is an essential component in Integrated Voltage Regulator(IVR) which is strongly corresponding to the efficiency of power management. In 2018 ECTC, an on-chip solenoid inductor package integrated with high-permeability magnetic(MAG) film and
Autor:
Hsiao-Ling Huang, Shawn Yang, Chang Chien-Hung, Marvin Liao, Edward Chen, Alex Kalnitsky, C. C. Kuo, T. C. Chang, K. C. Liu, C.C. Hsu, G. C. Huang, Chun-Kuang Chen, K. Y. Wu, Tsung-Yu Yang, Harry Ku, W. L. Huang
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
In 2017 ECTC, we demonstrated an on-chip thick copper "Air-core" inductor integrated with proposed WLCSP-like packaging solution. This year, the spotlight of the upgraded on-chip inductor package is two-fold. The first is a planar magnetic (MAG) film
Autor:
King-Yuen Wong, Fu-Wei Yao, Chung-Yi Yu, Chih-Chieh Yeh, Yun-Hsiang Wang, Wen-De Wang, Yu-Syuan Lin, Ru-Yi Su, Ming-Huei Lin, S.-C. Liu, M.-H. Chang, Jan-Wen You, C.H. Tsai, S.-P. Wang, Man-Ho Kwan, Haw-Yun Wu, C. B. Wu, Ching-Ray Chen, Alex Kalnitsky, Tze-Chiang Huang, Chan-Hong Chern, L. Y. Tsai, H. C. Tuan, W.-C. Yang, J. L. Yu, Chen Po-Chih
Publikováno v:
2017 IEEE International Electron Devices Meeting (IEDM).
This paper explores the next stage of GaN power devices with 2-level integration of peripheral low voltage active and passive devices. The 1st level consists of protection/control/driving circuits, which potentially improves the performance and overc
Autor:
Ivan Wu, Dun-Nian Yaung, Alex Kalnitsky, George Liu, Emerson Cheng, B. J. Woo, Huang Shih-Fen
Publikováno v:
2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).
"Smart" cars, houses, offices, cities, etc. require increasingly large variety of sensors and associated electronics. This paper describes T SMC's activities in motion, pressure, optical and bio sensors that we hope will help transform "smart everyth
Autor:
C. C. Chou, T. Y. Chou, Chih-Ming Chen, Alex Kalnitsky, W. L. Huang, Ching-Fang Chen, Chun-Kuang Chen, K. C. Liu, Tsung-Yu Yang, S. B. Yang, Chang Chien-Hung, G. C. Huang, Marvin Liao, Hsin-Ting Huang, Ku Chin-Yu, C.C. Hsu
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Implementation of thick Cu inductor in IC chips has been a highly challenging task for Far-backend packaging industry. One of the major concerns is that the thicker Cu trace wrapped by re-passivation polymer layers (Polymer-1 & Polymer-2) is often ac
Autor:
C.Y. Chan, J. L. Yu, Chang Yu-Chi, H. C. Tuan, C. B. Wu, Yu-Syuan Lin, Ru-Yi Su, King-Yuen Wong, Tsai Chun-Lin, Ming-Cheng Lin, Nan-Ying Yang, C.L. Yeh, Fu-Wei Yao, Man-Ho Kwan, Chen Po-Chih, M. W. Tsai, F. J. Yang, Alex Kalnitsky, Haw-Yun Wu, J. L. Tsai
Publikováno v:
2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD).
GaN Cascode performance optimization for high efficient power applications is presented in this paper. Analytical equations of Cascode capacitance network (Ciss, Coss, Cgd) is demonstrated and the equations accuracy is verified through experimental m
Autor:
K. C. Liu, Ryan R. Davies, W. C. Hua, Wu Kuo-Ming, Hao Wu, Jeff Wu, Y. S. Su, Kenneth L. Shepard, K. W. Cheng, Y. C. Wang, Michael Lekas, Alex Kalnitsky, Chang Chien-Hung, Chun-Kuang Chen, Noah Sturcken, C. C. Hsu, Chung-Hao Tsai
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM).
This paper presents the fabrication, design and electrical performance of magnetic thin-film inductors for monolithic integration with CMOS for DC-DC power conversion. Magnetic core inductors were fabricated using conventional CMOS processes to achie
Autor:
K.-Y. Roy Wong, Chen Po-Chih, C. B. Wu, Ching-Ray Chen, C. W. Hsiung, Ming-Huei Lin, F. J. Yang, Liao Yan-Jie, M. W. Tsai, Yani Lai, Chiu Hsien-Kuang, Tom Tsai, Man-Ho Kwan, Sheng-Da Liu, Burn Jeng Lin, Chang Yu-Chi, Jan-Wen You, Alex Kalnitsky, Chen-Shien Chen, M.-H. Chang, J. L. Yu, L. Y. Tsai, Yu-Syuan Lin, P.-C. Liu, Ru-Yi Su, Fu-Wei Yao, H. C. Tuan, L. C. Chen, Haw-Yun Wu, K.-L. Chiu, Chia-Shiung Tsai, Chung-Yi Yu, S.-P. Wang, G. P. Lansbergen, Chiang Chen-Hao
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM).
CMOS-compatible 100 V / 650 V enhancement-mode high electron mobility transistors (E-HEMTs) and 650 V depletion-mode MISFET (D-MISFET) are fabricated on 6-inch GaN-on-Si wafers. These devices show excellent power converter switching performances. Bot