Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Alex Gritti"'
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
MEMS mirrors are among the most promising devices for the new wave of MEMS actuator devices. The general purpose of the devices(s) is to deviate a laser beam and scan a two-dimensional target. To limit the complexity of design and to maximize perform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5570faf54ead3789f74df0fbbac9bba5
https://doi.org/10.23919/empc53418.2021.9584995
https://doi.org/10.23919/empc53418.2021.9584995
Autor:
Aurora Sanna, Luca Maggi, Marco Del Sarto, Amedeo Maierna, Alex Gritti, Damian Halicki, Giovanni Graziosi
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Silicon based semiconductors are becoming a source of innovation in the field of RF solutions, especially involved in devices used in our everyday life. Wi-Fi and Bluetooth® connections adopted in home-networking, consumer platforms and wearable dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::262d0eeff27150abb9c2f2d1083cf6a0
https://doi.org/10.23919/empc53418.2021.9584952
https://doi.org/10.23919/empc53418.2021.9584952
Autor:
Douglas Lodgson, Tom Quoc Lao, YiYi Ma, Marco Del, Nicolo' Manca, Roseanne Duca, Alex Gritti, David Cheng
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
In the field of MEMS sensors, package plays a primary role since it strongly affects device behavior and performance. Depending on the application and mission profile, design and package technology need to be targeted in order to fit the best the giv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84d6a9f81cb2ff1232856fd97a3f9cfe
https://doi.org/10.1109/ectc32862.2020.00075
https://doi.org/10.1109/ectc32862.2020.00075
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In the field of MEMS and sensors, package plays a primary role since it strongly affects device behavior and performance. Depending on the application and industrial domain, the design needs to be targeted toward the given requirements. The same sens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4dc5ab693215601b80f93d9c4d2db18
https://doi.org/10.1109/itherm.2019.8757310
https://doi.org/10.1109/itherm.2019.8757310