Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Alex Bruderer"'
Autor:
Thomas Gottwald, Tetsuya Onishi, Alex Bruderer, Letz Martin, Siddharth Ravichandran, Brandon T. Gore, William J. Kozlovsky, Romeo Premerlani, Holger Maune, Mathias Mydlak, Shigeo Onitake, Manuel Martina, Jost Matthias
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A number of glass substrates made from the SCHOTT glass AF32_eco in a thickness of 0.1mm are metallized with different processes. On the metallized glass substrates, microstrip lines as well as ring resonator structures are realized which are optimiz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2a28efba8827cd33615e5fef95f00700
https://doi.org/10.1109/ectc.2019.00115
https://doi.org/10.1109/ectc.2019.00115
Autor:
Joris Lambrecht, Tobias Lamprecht, Alex Bruderer, Xin Yin, Felix Betschon, Romeo Premerlani, Hannes Ramon
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
Efficient packaging of integrated photonic chips (PIC) on host substrates is essential to fully deploy their potential and to co-integrate electronic chips (EIC). A high-performance electro-optical printed circuit board (EOCB), which exhibits a combi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c5bb2fe0eff00c4d68e2e179223e2ee4
Publikováno v:
Proceedings of SPIE; 12/5/2022, Vol. 12007, p120070D-120070D-10, 1p