Zobrazeno 1 - 10
of 121
pro vyhledávání: '"Ales Hamacek"'
Publikováno v:
Materials; Volume 15; Issue 23; Pages: 8686
This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceram
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d1c76788fe6f9138c97314b1ca5b9068
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcc761e154b07e4cdc3bae72d755f0ae
https://doi.org/10.1109/isse54558.2022.9812767
https://doi.org/10.1109/isse54558.2022.9812767
Publikováno v:
Scripta Materialia. 176:23-27
This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology. The copper films were printed with a new adhesion copper paste designed for both AlN and Al2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6a75073ed382409e8b09c6ce2b1340d2
https://doi.org/10.1016/j.scriptamat.2019.09.029
https://doi.org/10.1016/j.scriptamat.2019.09.029
This article addresses the higher temperature washing reliability research of interconnection technique for mounting SMD (surface mounted device) components onto conductive stretchable textile ribbons. It can be concluded that both tested interconnec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::38898cccf87f1f22d6f4f72e4aeb3ec1
http://hdl.handle.net/11025/49773
http://hdl.handle.net/11025/49773
Publikováno v:
Materials; Volume 15; Issue 4; Pages: 1372
This paper is focused on a new copper-nickel thick film resistive paste which was designed and experimentally developed for the realization of low-ohmic power resistors. This copper-nickel paste has been designed for use in combination with thick pri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fb7f7705326ab22f11c81d9058b4d653
http://hdl.handle.net/11025/47498
http://hdl.handle.net/11025/47498
This paper is focused on printed resistors compatible with Thick Printed Copper (TPC). TPC technology is new prospective technology for the realization of power electronic substrates and can be used as an alternative to conventional Direct Bonded Cop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::17566a6c1fe8741d0429ee23b2889b94
http://hdl.handle.net/11025/50935
http://hdl.handle.net/11025/50935
Publikováno v:
Molecular Crystals and Liquid Crystals. 694:1-20
Three ionic liquids (ILs), 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide, 1-butyl-3-methylimidazolium trifluoromethanesulfonate, and 1-ethyl-3-methylimidazolium tetrafluoroborate, w...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67f7094eac674b45361f1beb45aff9f8
https://doi.org/10.1080/15421406.2020.1723892
https://doi.org/10.1080/15421406.2020.1723892
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This paper is focused on the noncovalent functionalization of CNT by π stacking of molecules for relative humidity (RH) sensing. This type of functionalization is not used frequently, but it potentially offers a simple way how to control the level o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::12ae698ad79b0da3a934d9c7cbc2ebc2
https://doi.org/10.1109/isse51996.2021.9467585
https://doi.org/10.1109/isse51996.2021.9467585
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::248b864342cd6424e49d4e5a94bfc81e
https://doi.org/10.1109/isse51996.2021.9467635
https://doi.org/10.1109/isse51996.2021.9467635
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This paper is focused on the characterization of silver conductive thick film pastes determined for aluminum nitride (AlN) substrates. Aluminum nitride is a ceramic material with high thermal conductivity and a different structure compared to alumina
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7acddeb0f739bb64e8f10d5ae90c4475
https://doi.org/10.1109/isse51996.2021.9467661
https://doi.org/10.1109/isse51996.2021.9467661