Failure Mechanisms in Flip-Chip Bonding on Stretchable Printed Electronics

Autor: Markus Tuomikoski, Aleksis Leinonen, Mohammad H. Behfar, Matti Mäntysalo, Elina Jansson, Behnam Khorramdel, Arttu Korhonen

Publikováno v: Behfar, M H, Khorramdel, B, Korhonen, A, Jansson, E, Leinonen, A, Tuomikoski, M & Mäntysalo, M 2021, ' Failure Mechanisms in Flip-Chip Bonding on Stretchable Printed Electronics ', Advanced Engineering Materials, vol. 23, no. 12, 2100264 . https://doi.org/10.1002/adem.202100264

Accelerating progress in printed electronics technology transforms the future of the manufacturing process in industrial applications, consumer electronics, and healthcare products. However, real-life applications demand for circuits and systems that

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https://cris.vtt.fi/ws/files/53434845/adem.202100264.pdf