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pro vyhledávání: '"Alden R. Pack"'
Autor:
Larry K. Warne, Aaron M. Krueger, Vinh Dang, Brian Zinser, Jon W. Wallace, Robert A. Pfeiffer, J.D. Kotulski, Alden R. Pack, William A. Johnson, William L. Langston
Publikováno v:
2021 International Conference on Electromagnetics in Advanced Applications (ICEAA).
Metallic enclosures are commonly used to protect electronic circuits against unwanted electromagnetic (EM) interactions. However, these enclosures may be sealed with imperfect mechanical seams or joints. These joints form narrow slots that allow exte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a08a44befeb3d4ef8a5a5663d168eab2
https://doi.org/10.1109/iceaa52647.2021.9539557
https://doi.org/10.1109/iceaa52647.2021.9539557
