Zobrazeno 1 - 10
of 116
pro vyhledávání: '"Alberto Garcia-Ortiz"'
Publikováno v:
IEEE Open Journal of Circuits and Systems, Vol 5, Pp 178-188 (2024)
Specialized compute blocks have been developed for efficient nn execution. However, due to the vast amount of data and parameter movements, the interconnects and on-chip memories form another bottleneck, impairing power and performance. This work add
Externí odkaz:
https://doaj.org/article/69f456498f434569bfd63a9cc0ff980d
Autor:
Yarib Nevarez, Andreas Beering, Amir Najafi, Ardalan Najafi, Wanli Yu, Yizhi Chen, Karl-Ludwig Krieger, Alberto Garcia-Ortiz
Publikováno v:
IEEE Access, Vol 11, Pp 4852-4868 (2023)
The use of artificial intelligence (AI) in sensor analytics is entering a new era based on the use of ubiquitous embedded connected devices. This transformation requires the adoption of design techniques that reconcile accurate results with sustainab
Externí odkaz:
https://doaj.org/article/de601496a3f9422aab2885ba2254f294
Publikováno v:
Frontiers in Computational Neuroscience, Vol 17 (2023)
Over the past decade a body of work has emerged and shown the disruptive potential of neuromorphic systems across a broad range of studies, often combining novel machine learning models and nanotechnologies. Still, the scope of investigations often r
Externí odkaz:
https://doaj.org/article/7eeed83e220d497b9d9704921e1c923d
Autor:
Robert Schmidt, Alberto Garcia-Ortiz
Publikováno v:
IEEE Access, Vol 10, Pp 14586-14599 (2022)
Fault-tolerant real-time systems for emerging critical applications like wearable electronic healthcare monitors, consumer-grade unmanned aerial vehicles, or environmental monitoring have to tolerate errors during operation. If they fail, the consequ
Externí odkaz:
https://doaj.org/article/38fde3c4a5a641d3b272983e56743c5c
Publikováno v:
IEEE Access, Vol 9, Pp 80603-80620 (2021)
Spiking neural networks (SNNs) represent a promising alternative to conventional neural networks. In particular, the so-called Spike-by-Spike (SbS) neural networks provide exceptional noise robustness and reduced complexity. However, deep SbS network
Externí odkaz:
https://doaj.org/article/f0b7e98afae54a70adb46686eaa52e19
Autor:
Robert Schmidt, Alberto Garcia-Ortiz
Publikováno v:
IEEE Access, Vol 9, Pp 43540-43550 (2021)
Mixed-criticality scheduling in modern deeply embedded mission and safety-critical systems needs to consider delivered service, that is, the runtime in low criticality mode. If the change into a higher criticality mode is triggered by the first overr
Externí odkaz:
https://doaj.org/article/a2d02a2d67054df68e223bdbf1cd9754
Publikováno v:
IEEE Access, Vol 7, Pp 121931-121948 (2019)
Many-core architectures integrate a large number of comparatively small processing cores into a single chip. However, the high degree of parallelism increases the run-time resource management complexity and overhead. The employment of dedicated hardw
Externí odkaz:
https://doaj.org/article/d5d4f6b29c9746208fe21f44178045e7
Publikováno v:
IEEE Access, Vol 7, Pp 179220-179234 (2019)
Approximate computing has been broadly investigated in the computing domain to maintain the benefits of technology scaling. Recently, it has been extended to the communication domain. The idea is to trade transmission quality for energy or/and perfor
Externí odkaz:
https://doaj.org/article/c044fc1e49c2410580a3c4317016ecdc
Autor:
Jan Moritz Joseph, Lennart Bamberg, Dominik Ermel, Behnam Razi Perjikolaei, Anna Drewes, Alberto Garcia-Ortiz, Thilo Pionteck
Publikováno v:
IEEE Access, Vol 7, Pp 135145-135163 (2019)
Heterogeneous 3D System-on-Chips (3D SoCs) are the most promising design paradigm to combine sensing and computing within a single chip. A special characteristic of communication networks in heterogeneous 3D SoCs is the varying latency and throughput
Externí odkaz:
https://doaj.org/article/740b62139bef4506842b1108a709090b
Autor:
Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto Garcia-Ortiz, Dragomir Milojevic, Francky Catthoor, Gioele Mirabelli, Manu Komalan, Sung Kyu Lim
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:300-314