Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Albert Sutono"'
Autor:
Amy Luoh, Shaohui Yong, Vijay Kunda, Xiaoning Ye, Bo Pu, Yuandong Guo, Dong-Hyun Kim, Jun Fan, Jiayi He, Albert Sutono, Yuanzhuo Liu
Publikováno v:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium.
Far-end crosstalk (FEXT) can reduce the eye opening and eventually decrease the maximum data rate that can be transmitted through the high-speed interconnections. Therefore, FEXT is an important concern in high-speed digital design. The contributors
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::699cb8f1947b2797a3c8b878ce92907d
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559363
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559363
Autor:
Yuanzhuo Liu, Jun Fan, Dong-Hyun Kim, Liang Liu, Amy Luoh, Vijay Kunda, Jiayi He, Xiaoning Ye, Shaohui Yong, Yuandong Guo, Albert Sutono, Yunhui Chu, Nick Kutheis
Publikováno v:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium.
Far-end crosstalk (FEXT) noise is a critical factor that affects signal integrity performance in high-speed systems. The FEXT level is sensitive to the dielectric inhomogeneity of the stripline in fabricated printed circuit boards (PCB). Stripline is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::741e7a387a430e6676b815c88333cb3a
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559227
https://doi.org/10.1109/emc/si/pi/emceurope52599.2021.9559227
Publikováno v:
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).
Traditional crosstalk measurements require more ports on the test equipment, especially for differential configuration and are therefore costly. Another challenge is the need of perfect termination on the non-measurement ports, which is not practical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89bfb843d759383e03221e34f5730d9b
https://doi.org/10.1109/isemc.2018.8393758
https://doi.org/10.1109/isemc.2018.8393758
Autor:
Kyutae Lim, Sangwoo Han, Albert Sutono, E.M. Tentzeris, Stephane Pinel, Chang-Ho Lee, J. Laskar
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:374-384
Presents design, implementation, and measurement of a three-dimensional (3-D)-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based transmitter m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::398816774a1f6c467bb6b7efae79c6e5
https://doi.org/10.1109/tadvp.2002.805315
https://doi.org/10.1109/tadvp.2002.805315
Publikováno v:
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
We present a 2.4 GHz SiGe HBT power amplifier integrated with a harmonic suppression filter implemented in a high-Q multilayer low-temperature cofired ceramic (LTCC) substrate at the output. The power amplifier delivers a power of up to 27.5 dBm with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5a3d83371b2f557de736f8c7d8cf0ad
https://doi.org/10.1109/mwsym.2002.1011804
https://doi.org/10.1109/mwsym.2002.1011804
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Conference
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