Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Albert K. Henning"'
Publikováno v:
2015 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
It is well recognized that dimensional scaling has reached its diminishing return phase and the industry is now looking to monolithic 3D to be the future technology driver. This was clearly voiced in the Qualcomm keynote at DAC 2014 and follow-on pre
Autor:
Albert K. Henning
Publikováno v:
Journal of Microelectromechanical Systems. 15:1308-1318
Thermopneumatic actuators have been used in a variety of microelectromechanical systems (MEMS) applications, particularly in the area of microvalves. However, a relatively simple model which relates the steady-state and transient response of the actu
Publikováno v:
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
It is well recognized that dimensional scaling has reached its diminishing return phase and the industry is now looking to monolithic 3D to be the future technology driver. This was clearly voiced in the Qualcomm keynote at DAC 2014. This paper will
Autor:
Albert K. Henning, Wendell Mcculley, L. Christel, James M. Harris, M. Zdeblick, Y. Fathi, Bradford A. Cozad, E.B. Dehan, Dean Allyn Hopkins, L.J. Lilly, W.A. Weber, J.S. Firch
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 21:329-337
The advent of MEMS (microelectromechanical systems) will enable dramatic changes in semiconductor processing. MEMS-based devices offer opportunities to achieve higher performance and functionality, at lower cost, with decreased size and increased rel
Publikováno v:
2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
A major consideration for practical integration of 3D integrated circuits is compatibility of the thermal processes used to build new transistors in the vertical dimension, with sustained viability of the devices already fabricated beneath. Major con
Publikováno v:
3DIC
Classical dimensional scaling faces challenges from growing on-chip interconnect time delays, and escalating lithography costs and layout limitations. In this paper, we present practical integration schemes for developing cost-efficient 3D ICs in a m
Publikováno v:
SPIE Proceedings.
The conventional approach to measurement of the deflection of microfabricated cantilevers centers on the use of an optical lever. The use of optical lever technology increases the size, complexity, and cost of systems using microfabricated cantilever
Publikováno v:
SPIE Proceedings.
An all-at-once factorial method is presented, which optimizes protein ink deposition using microfabricated pens by identifying the pen design which writes the greatest number of uniform-size spots or droplets without re-inking. Pen features associate
Autor:
Todd Hochwitz, Albert K. Henning
Publikováno v:
Materials Science and Engineering: B. 42:88-98
We have extended the capabilities of an atomic force microscope (AFM) with double heterodyne force detection, to include both electrostatic force microscopy (EFM) and scanning differential capacitance microscopy (SdCM). Samples measured with this too
Autor:
Todd Hochwitz, Steven Hoffmann, James M. Never, Charles Daghlian, James A. Slinkman, Phil Kaszuba, Albert K. Henning
Publikováno v:
Journal of Applied Physics. 77:1888-1896
A simultaneous combination of scanning Kelvin probe microscopy and scanning atomic force microscopy has been applied to the problem of profiling dopant concentrations in two dimensions in silicon microstructures. By measuring the electrochemical pote