Výsledky vyhledávání - "Albert H. Liu"

Yoga as an adjunctive treatment for nonoperative low-back pain

Autor: Alexandra H. Seidenstein, Albert H. Liu, David B. Kurland, Erich G. Anderer, Eddie Stern, Monica C. Mureb

Publikováno v: Journal of Neurosurgery: Spine. 36:517-521

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6824a44858df7a10ff2b0c337915cb23
https://doi.org/10.3171/2021.6.spine2198

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A case of intractable psychosis following interferon therapy

Autor: Stephanie X. Wu, Albert H. Liu, Daniel P McGonigle, Wei Qi

Publikováno v: Australian & New Zealand Journal of Psychiatry. 53:1123-1124

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b88ae2fa5f39c640b17bff9d0a24ea3a
https://doi.org/10.1177/0004867419857817

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Defect detection strategies for chemical-mechanical polishing process in shallow-trench isolation applications

Autor: Albert H. Liu, Jane J. Li, Scott S. Hiemke

Publikováno v: SPIE Proceedings.

Shallow trench isolation (STI) process has become an architectural requirement for sub 0.25 micron device rules, as localized oxidation of silicon (LOCOS) does not deliver the benefits from smaller design rule. The challenge of STI is not only typica

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4fe6814db485d6fd0f852bc47aa4924d
https://doi.org/10.1117/12.361347

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Alignment performance as a function of chemical mechanical polishing techniques and stepper optimization

Autor: Bryan Hubbard, Albert H. Liu

Publikováno v: SPIE Proceedings.

Optimized alignment for chemical mechanical polishing has been studied in detail to ascertain the best overall overlay and process conditions. This paper describes the methodology of alignment mark design and testing in conjunction with chemical mech

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::b06874058f23e62a29834d7a83b3288c
https://doi.org/10.1117/12.346882

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Utilization of optical metrology as an in-line characterization technique for process performance improvement and yield enhancement of dielectric and metal CMP in IC manufacturing

Autor: John H. Givens, Albert H. Liu, Randy Solis

Publikováno v: SPIE Proceedings.

Optical metrology equipment has been widely used as the process qualification gauge for chemical mechanical polish and planarization (CMP) processes. However, most of the effort has concentrated on blanket-film wafers. Recent advancements in the opti

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fa1b921e3657e9fb57acff9336a8c13d
https://doi.org/10.1117/12.346903

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Development of a Robust KIO3 Tungsten CMP Process

Autor: Randy Solis, John H. Givens, Albert H. Liu

Publikováno v: MRS Proceedings. 566

A production worthy, Tungsten Chemical Mechanical Polish (CMP) process using a commercially available K103 slurry was developed, characterized, and tested for sub-0.35μm multilevel interconnect fabrication. The effects of pre-tungsten CMP process on

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::73d8496daeb2cd10bef64afacdb92a94
https://doi.org/10.1557/proc-566-83

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