Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Albert C. W. Lu"'
Publikováno v:
Journal of Electroceramics. 16:581-585
Polycrystalline BaTiO3 films were hydrothermally grown on Ti-coated substrates from 80∘C to 200∘C. Films grown at 200∘C exhibited the lowest dielectric loss of around 0.1. Proton incorporation was more severe for the 80∘C film resulting in hi
Publikováno v:
Journal of Physics: Conference Series. 34:368-372
This research aims to develop capabilities in patterning micro-, nano- structures and devices using thermoplastics. Fundamental investigations are conducted using NEB-22 resist as the substrate material in the imprinting of micro- and nano- structure
Publikováno v:
International Journal of RF and Microwave Computer-Aided Engineering. 16:259-267
An integrated-circuit package antenna (ICPA) offers an elegant antenna solution for single-chip wireless transceivers. This article presents such an ICPA with an emphasis on its feeding technique from the carried single-chip wireless transceiver. Thi
Publikováno v:
Microelectronics Reliability. 44:755-769
This paper describes a thermal design methodology for a 2.5 Gbps optical transmitter that mainly comprises a laser array of 12 VCSELs and a laser driver module. An integrated heat sink design was performed and optimized through modeling and simulatio
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Large area polymer films with patterned microstructures are expected to be widely used in various areas, such as functional optical films for flexible displays, lighting devices as well as structured films for microfluidic components. Large area embo
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
Large format roll-to-roll (R2R) embossing is a continuous process suitable for manufacturing large area functional films at low cost and high throughput. R2R ultraviolet (UV) embossing has several advantages over R2R hot embossing as it offers lower
Autor:
Stephen C. K. Wong, Lai Lai Wai, Wei Fan, Albert C. W. Lu, Kim H. Chin, Toshio Yamazaki, Jacinto Jun Jarcia
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
This paper will describe the high-frequency analysis and characterization of embedded resistors fabricated in organic substrates. Although embedded resistors have been widely used in organic substrates, detailed analysis and characterization at high
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
To meet the insatiable demand for data bandwidth in VSR (very short reach up to 300m) applications including server and routers, parallel optical interconnection offers a promising solution in terms of performance and cost effectiveness. A 12-channel