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of 4
pro vyhledávání: '"Alan D. Knight"'
Autor:
Hisham Tariq, Zia Sadique, Logan Manikam, Alan D. Knight, Yebeen Boo, Mishal S Khan, Osman Dar, David Emes, Alexander Light
Publikováno v:
UCL Open Environment (2020)
Purpose: The Ebola Virus Disease (EVD) epidemic was one of the most severe public health emergencies in modern times. The economic impact of epidemics has mostly been analysed at the macroeconomic level. Conversely, we aimed to estimate the economic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0402b4560698d3bd9e3b1cf10a47adbe
https://usir.salford.ac.uk/id/eprint/64099/1/ucloe-02-007.pdf
https://usir.salford.ac.uk/id/eprint/64099/1/ucloe-02-007.pdf
Publikováno v:
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
This paper discusses a molded elastomeric structure that has been developed for use in connector applications. With the use of elastomeric materials, several challenges occur such as: dimensional stability for a grid of contacts as the elastomer memb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a097337072e2d48b1a5a40dc781429f
https://doi.org/10.1109/ectc.1993.346805
https://doi.org/10.1109/ectc.1993.346805
Autor:
Alan D. Knight
Publikováno v:
Multichip Module Technologies and Alternatives: The Basics ISBN: 9780442012366
Electronic packaging involves many levels of connections for components, subsystems and systems. The connections between the individual die and the multichip module (MCM) substrate forms a level 1 connection. A level 2 connection joins the MCM to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2a73511f849b37bc08f14d854c225b3
https://doi.org/10.1007/978-1-4615-3100-5_10
https://doi.org/10.1007/978-1-4615-3100-5_10
Conference
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