Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Alain Gueugnot"'
Autor:
Thomas Kaltsounis, Helge Haas, Matthieu Lafossas, Simona Torrengo, Vishwajeet Maurya, Julien Buckley, Denis Mariolle, Marc Veillerot, Alain Gueugnot, Laurent Mendizabal, Yvon Cordier, Matthew Charles
Publikováno v:
Microelectronic Engineering. 273:111964
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ac69f37f368818fdd2aad906e15d3e1
https://doi.org/10.1016/j.mee.2023.111964
https://doi.org/10.1016/j.mee.2023.111964
Epoxy Wetting Flow and Adhesion Mechanism within a Small Gap and Small Pitch Copper Pillar Structure
Autor:
Mary-Ann Gasser, Abdenacer Ait Mani, Thierry Mourier, Alain Gueugnot, Patrick Peray, Loic Vanel, Catherine Barentin
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3da824256fc67319fdb32a0aa122574
https://doi.org/10.1109/ectc51906.2022.00021
https://doi.org/10.1109/ectc51906.2022.00021
Autor:
Guillaume Moritz, Gael Pillonnet, Frédéric Berger, Denis Dutoit, Alexandre Arriordaz, David Coriat, Lucile Arnaud, Julian Pontes, Eric Guthmuller, Christian Bernard, Fabien Clermidy, Alexis Farcy, Didier Varreau, P. Coudrain, Alain Greiner, J. Durupt, Michel Harrand, Didier Lattard, Quentin L. Meunier, Jean Charbonnier, Ivan Miro-Panades, Sebastien Thuries, Cesar Fuguet, Arnaud Garnier, Severine Cheramy, Alain Gueugnot, Pascal Vivet, Yvain Thonnart
Publikováno v:
IEEE Journal of Solid-State Circuits
IEEE Journal of Solid-State Circuits, Institute of Electrical and Electronics Engineers, 2021, 56 (1), pp.79-97. ⟨10.1109/JSSC.2020.3036341⟩
IEEE Journal of Solid-State Circuits, 2021, 56 (1), pp.79-97. ⟨10.1109/JSSC.2020.3036341⟩
IEEE Journal of Solid-State Circuits, Institute of Electrical and Electronics Engineers, 2021, 56 (1), pp.79-97. ⟨10.1109/JSSC.2020.3036341⟩
IEEE Journal of Solid-State Circuits, 2021, 56 (1), pp.79-97. ⟨10.1109/JSSC.2020.3036341⟩
In the context of high-performance computing, the integration of more computing capabilities with generic cores or dedicated accelerators for artificial intelligence (AI) application is raising more and more challenges. Due to the increasing costs of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4012e9cdfa24d7a486fffa94ba46e77
https://hal.archives-ouvertes.fr/hal-03072959/document
https://hal.archives-ouvertes.fr/hal-03072959/document
Autor:
Laura Boutafa, Natacha R Aphoz, Patrick Peray, Frédéric Berger, Mireille Francou, Nadia Miloud-Ali, David Henry, Thierry Mourier, Nohora Caicedo, Alain Gueugnot, T. Chaira, Alexis Bedoin, F. Levy, Abdenacer Ait Mani
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
The continuous evolution of electronic devices has increased a serious concern on 2.5D and 3D advanced packaging. Applications in domains such as displays, automotive, defense or space, require large volumes of interconnects to cover large areas in o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f30c9615ea5f158f21df51701400b615
https://doi.org/10.1109/estc48849.2020.9229685
https://doi.org/10.1109/estc48849.2020.9229685
Autor:
Lucile Arnaud, David Coriat, Cesar Fuguet, Perceval Coudrain, Julian Pontes, Ivan Miro-Panades, Sebastien Thuries, J. Durupt, Didier Varreau, D. Lattard, Alexis Farcy, Alexandre Arriordaz, Eric Guthmuller, Alain Greiner, Christian Bernard, Severine Cheramy, Gael Pillonnet, Guillaume Moritz, Alain Gueugnot, Yvain Thonnart, Quentin L. Meunier, Frédéric Berger, Jean Charbonnier, Pascal Vivet, Fabien Clermidy, Michel Harrand, Arnaud Garnier, Denis Dutoit
Publikováno v:
ISSCC
In the context of high-performance computing and big-data applications, the quest for performance requires modular, scalable, energy-efficient, low-cost manycore systems. Partitioning the system into multiple chiplets 3D-stacked onto large-scale inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::290cb64ff9abb64db868f6d26d6fcd40
https://doi.org/10.1109/isscc19947.2020.9062927
https://doi.org/10.1109/isscc19947.2020.9062927
Autor:
Alain Gueugnot, S. Bisotto, L. Mathieu, T. Chaira, Frédéric Berger, Sébastien Renet, O. Mailliart, Y. Goiran, S. Gout
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Flip chip is a high-density and highly reliable interconnection technology, which is mandatory for the fabrication of high end heterogeneous imaging arrays. In the field of cooled infrared detectors, indium balls interconnections technology is well m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d90afade00a7ddcdcdc190a2ba07334e
https://doi.org/10.23919/empc44848.2019.8951830
https://doi.org/10.23919/empc44848.2019.8951830
Autor:
Didier Campos, P. Coudrain, Yorrick Exbrayat, Lucile Arnaud, Stephane Minoret, F. Ponthenier, Andrea Vinci, Severine Cheramy, Alain Gueugnot, Daniel Scevola, Cesar Fuguet Tortolero, P. Chausse, Roselyne Segaud, Giovanni Romano, Christophe Aumont, Didier Lattard, Jean Charbonnier, Pierre-Emile Philip, C. Ribiere, Arnaud Garnier, Jean Michailos, Mathilde Gottardi, Raphael Eleouet, Frédéric Berger, Eric Guthmuller, Gilles Simon, Jerome Beltritti, Gilles Romero, Maxime Argoud, Denis Dutoit, Alexis Farcy, Nacima Allouti, Therry Mourier, Remi Velard, Pascal Vivet, Corinne Legalland
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8afe955b96b263c988971d8f1f91372
https://doi.org/10.1109/ectc.2019.00092
https://doi.org/10.1109/ectc.2019.00092
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
This paper describes an interconnect technology based on copper pillar for the assembly of Si on Si die at a 10 μm pitch and format as large as 1cm2. Slowly some technologies are being developed at this pitch, especially in some niche application. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f5ad11725d0ad428d8ac60ff432da78
https://doi.org/10.1109/estc.2018.8546408
https://doi.org/10.1109/estc.2018.8546408
Autor:
David Henry, T. Catelain, F. Templier, Alain Gueugnot, S. Bisotto, L. Mathieu, F. Marion, Frédéric Berger
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper highlights the limits that may be encountered when thermally assembling large chips having substantial mismatches of their thermal expansion coefficient (CTE). First, a theory is proposed that shows the size limitation of "emitting" or "im
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9d4b9210fc897594ae6d4edb458856e
https://doi.org/10.1109/ectc.2016.39
https://doi.org/10.1109/ectc.2016.39
Autor:
M. Volpert, Frédéric Berger, François Marion, R. Anciant, B. Goubault de Brugiere, H. Ribot, Alain Gueugnot, Alexis Bedoin
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
In this work we show that high density and very low pitches face to face Aluminum/Aluminum cold bonding is feasible when using Aluminum coated micro-tubes inserted into Aluminum pads. First, mechanical simulations by FEM show that the insertion press
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53b5aab8d106cf84a8b5578d2724ef1c
https://doi.org/10.1109/ectc.2013.6575565
https://doi.org/10.1109/ectc.2013.6575565