Zobrazeno 1 - 10
of 481
pro vyhledávání: '"Akira Uedono"'
Autor:
Akira Uedono, Ryo Tanaka, Shinya Takashima, Katsunori Ueno, Masaharu Edo, Kohei Shima, Kazunobu Kojima, Shigefusa F. Chichibu, Shoji Ishibashi
Publikováno v:
Scientific Reports, Vol 11, Iss 1, Pp 1-8 (2021)
Abstract A process for activating Mg and its relationship with vacancy-type defects in Mg-implanted GaN were studied by positron annihilation spectroscopy. Mg+ ions were implanted with an energy of 10 keV, and the Mg concentration in the subsurface r
Externí odkaz:
https://doaj.org/article/872ed79336d94b0583d3cbbb01e7330f
Autor:
Yoshihiro Irokawa, Toshihide Nabatame, Kazuya Yuge, Akira Uedono, Akihiko Ohi, Naoki Ikeda, Yasuo Koide
Publikováno v:
AIP Advances, Vol 9, Iss 8, Pp 085319-085319-5 (2019)
Interfaces in Al2O3/n-GaN capacitors fabricated on free-standing GaN substrates were investigated using sub-bandgap photo-assisted capacitance-voltage measurements. After post-metallization annealing (PMA) at 300 °C, the metal-oxide-semiconductor (M
Externí odkaz:
https://doaj.org/article/465bb7cbaac545f2b38decec312e732c
Double-Decker Silsesquioxane-Grafted Polysilsesquioxane Hybrid Films as Thermal Insulation Materials
Autor:
Takashi Hamada, Sakino Takase, Arata Tanaka, Kenta Okada, Susumu Mineoi, Akira Uedono, Joji Ohshita
Publikováno v:
ACS Applied Polymer Materials. 5:743-750
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ad7016829074ca67d79bddceef52dea
https://doi.org/10.1021/acsapm.2c01743
https://doi.org/10.1021/acsapm.2c01743
Autor:
Akira Uedono, Hideki Sakurai, Jun Uzuhashi, Tetsuo Narita, Kacper Sierakowski, Shoji Ishibashi, Shigefusa F. Chichibu, Michal Bockowski, Jun Suda, Tadakatsu Ohokubo, Nobuyuki Ikarashi, Kazuhiro Hono, Tetsu Kachi
Publikováno v:
Gallium Nitride Materials and Devices XVIII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1492a44cc4b0d5f01da6317355bd1cb0
https://doi.org/10.1117/12.2646233
https://doi.org/10.1117/12.2646233
Publikováno v:
ACS Applied Polymer Materials. 4:3726-3733
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e11d8e6d1585e2a769d6ddfd22fe2fe
https://doi.org/10.1021/acsapm.2c00241
https://doi.org/10.1021/acsapm.2c00241
Publikováno v:
ACS Applied Polymer Materials. 4:2851-2859
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0329c217f4dbf792cc63001cd0cb0777
https://doi.org/10.1021/acsapm.1c01812
https://doi.org/10.1021/acsapm.1c01812
Autor:
Akira Uedono, Naomichi Takahashi, Ryu Hasunuma, Yosuke Harashima, Yasuteru Shigeta, Zeyuan Ni, Hidefumi Matsui, Akira Notake, Atsushi Kubo, Tsuyoshi Moriya, Koji Michishio, Nagayasu Oshima, Shoji Ishibashi
Publikováno v:
2022 International Symposium on Semiconductor Manufacturing (ISSM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e519d99648f358df582654fb47d098ba
https://doi.org/10.1109/issm55802.2022.10027133
https://doi.org/10.1109/issm55802.2022.10027133
Autor:
Yosuke Harashima, Hiroaki Koga, Zeyuan Ni, Takehiro Yonehara, Michio Katouda, Akira Notake, Hidefumi Matsui, Tsuyoshi Moriya, Mrinal Kanti Si, Ryu Hasunuma, Akira Uedono, Yasuteru Shigeta
Publikováno v:
2022 International Symposium on Semiconductor Manufacturing (ISSM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5e7f7cfef500d2fb768c9915d8080f1
https://doi.org/10.1109/issm55802.2022.10027044
https://doi.org/10.1109/issm55802.2022.10027044
Publikováno v:
ACS Applied Polymer Materials. 3:3383-3391
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7d5ddd96ee632d04bf650a9c7f660a7
https://doi.org/10.1021/acsapm.1c00344
https://doi.org/10.1021/acsapm.1c00344
Autor:
Takeshi Nogami, Oleg Gluschenkov, Yasir Sulehria, Son Nguyen, Brown Peethala, Huai Huang, Hosadurga Shobha, Nick Lanzillo, Raghuveer Patlolla, Devika Sil, Andrew Simon, Daniel Edelstein, Nelson Felix, Junjun Liu, Toshiyuki Tabata, Fulvio Mazzamuto, Sebastien Halty, Fabien Roze, Yasutoshi Okuno, Akira Uedono
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe72a3442deaa820b16b410afc241c1c
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830488
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830488