Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Akira Takaguchi"'
Autor:
Toyohiro Aoki, Kazushige Toriyama, Akira Takaguchi, Yasumitsu Orii, Takashi Nauchi, Seiichirou Takahashi, Jun Mukawa, Koichi Hasegawa, Hiroyuki Mori, Hideki Nakamura
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 18:443-448
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79e13e3beb767121e0405a42b9596a88
https://doi.org/10.5104/jiep.18.443
https://doi.org/10.5104/jiep.18.443
Autor:
Peter J. Brofman, Derek Daily, Yasumitsu Orii, Takashi Nauchi, Kazuya Ishiguro, Paul A. Lauro, Tomoyasu Yoshikawa, Jeffrey D. Gelorme, Ryoichi Suzuki, Mark Harrison Mcleod, Peter J. Sorce, Eric D. Perfecto, Kazushige Toriyama, Akira Takaguchi, Jae-Woong Nah
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
In this paper, we will describe a new low cost solder bumping technology for use on wafers. The wafer IMS (injection molded solder) process can form fine pitch solder bumps on wafers, while offering greater solder alloy flexibility. This method is al
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::676c03e3f33638e3d705118b8d50795c
https://doi.org/10.1109/ectc.2014.6897461
https://doi.org/10.1109/ectc.2014.6897461
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1-38, 38p