Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Akira Chinda"'
Autor:
Akira Chinda
Publikováno v:
Journal of The Surface Finishing Society of Japan. 70:457-460
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1834b154c07c85d56d8451a9dceed2fb
https://doi.org/10.4139/sfj.70.457
https://doi.org/10.4139/sfj.70.457
Autor:
Akira CHINDA
Publikováno v:
Journal of The Surface Finishing Society of Japan. 62:422-428
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5b7cdaac23d1e5bda1ca5e9a149ca3b
https://doi.org/10.4139/sfj.62.422
https://doi.org/10.4139/sfj.62.422
Autor:
Akira Chinda
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 13:345-350
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37b1f663f7faad33276acbabdbca203f
https://doi.org/10.5104/jiep.13.345
https://doi.org/10.5104/jiep.13.345
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 10:477-483
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79ff3775366e45e3458480a12f253815
https://doi.org/10.5104/jiep.10.477
https://doi.org/10.5104/jiep.10.477
Autor:
Akira Chinda
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 7:386-390
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d9ed6cda71c8d3a565666aad6ceb8f9
https://doi.org/10.5104/jiep.7.386
https://doi.org/10.5104/jiep.7.386
Autor:
Akira CHINDA
Publikováno v:
Journal of The Surface Finishing Society of Japan. 54:118-123
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d62d7bbe216eadcf7d02524c2942c54
https://doi.org/10.4139/sfj.54.118
https://doi.org/10.4139/sfj.54.118
Autor:
Akira CHINDA
Publikováno v:
Journal of The Surface Finishing Society of Japan. 54:728-733
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::315e681c5142f8f16cd56bc1e9e4a915
https://doi.org/10.4139/sfj.54.728
https://doi.org/10.4139/sfj.54.728
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 6:307-313
微細ピッチBGAパッケージにおいて, はんだボール接合用ビアホールを銅めっきで部分充てんすることにより, はんだボールの接合信頼性が著しく向上した。本報では, そのメカニズムを種
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa87ed5eb4a5c5b9d04fa7c837d41022
https://doi.org/10.5104/jiep.6.307
https://doi.org/10.5104/jiep.6.307
Autor:
Osamu YOSHIOKA, Akira CHINDA
Publikováno v:
Electrochemistry. 70:888-893
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1be80387f20e299007277bd58c22477
https://doi.org/10.5796/electrochemistry.70.888
https://doi.org/10.5796/electrochemistry.70.888
Autor:
Akira Matsuura, Akira Chinda
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 5:394-400
The deterioration of ball solderability is indicated with the narrower pitch of solder balls of BGA package. Accordingly, the tape carrier that the via-holes for the ball soldering were buried with copper plating was developed for the prevention. In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::64a35ddce03e6628857109f83d1cd224
https://doi.org/10.5104/jiep.5.394
https://doi.org/10.5104/jiep.5.394