Zobrazeno 1 - 10
of 66
pro vyhledávání: '"Akinori Yui"'
Autor:
Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 852, Pp 17-00102-17-00102 (2017)
Si wafer diameter tends to be increased from 300 mm to 450 mm in order to increase semiconductor device productivity. To this end, the authors developed a rotary grinding machine with high stiffness, equipped with water hydrostatic bearings. This gri
Externí odkaz:
https://doaj.org/article/110200f9544746f494924e211bc75d0b
Autor:
Jumpei KUSUYAMA, Ayumu HONDA, Takayuki KITAJIMA, Go OKAHATA, Akinori YUI, Toshihiro ITO, A. H. SLOCUM
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 82, Iss 842, Pp 16-00190-16-00190 (2016)
Increasing of Si wafer diameter from φ300 mm to φ450 mm is required to enhance productivity of semiconductor devices. The authors developed a high stiff rotary grinding machine, which consists of a rotary table system and a wheel spindle system. Th
Externí odkaz:
https://doaj.org/article/6e8c8212acd3456f96963fec94eddea6
Selected, peer reviewed papers from the 17th International Symposium on Advances in Abrasive Technology (ISAAT 2014), September 22-25, 2014, Hawaii, USA
Selected, peer reviewed papers from the 15th International Symposium on Advances in Abrasive Technology (ISAAT 2012), September 25-28, 2012, Singapore
Publikováno v:
Asian Society for Precision Engineering and Nanotechnology (ASPEN 2022).
Publikováno v:
International Journal of Automation Technology. 16:3-4
Demand for the high-precision and high-efficiency machining of hard ceramics, such as silicon carbide for semiconductors and hardened steel for molding dies, has significantly increased for optical and medical devices as well as for powered devices i
Autor:
Kenji SUZUKI, Akinori YUI
Publikováno v:
The Proceedings of the National Symposium on Power and Energy Systems. :E114
Publikováno v:
Materials Science Forum. 874:395-400
For the backgrinding of semiconductor devices, a rotary grinding process is indispensable for achieving the required wafer thickness. The relative velocity between the grinding wheel and the wafer is maximum at the periphery of the wafer and minimum
Publikováno v:
Materials Science Forum. 874:487-491
Carbon-fiber-reinforced plastic (CFRP) is used in various industries such as aerospace and automobile industries because of its high mechanical characteristics. However, this material is difficult to cut. Tool wear and delamination frequently occur d
Autor:
Akinori Yui, Nagahisa Ogasawara, Hirotsugu Saito, Jumpei Kusuyama, Takayuki Kitajima, Shintaro Iwahashi, Alexander H. Slocum
Publikováno v:
Advanced Materials Research. 1136:655-660
Increasing the wafer diameter from φ300 mm to φ450 mm is required to enhance semiconductor devices productivity. A high-stiffness rotary grinding machine equipped with water hydrostatic bearings was developed for a φ450 mm silicon wafer. The grind