Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Akihito Yasui"'
Autor:
Akihito, Yasui
Publikováno v:
文化學年報 = Bunkagaku-Nempo (Annual report of cultural studies). 64:211-230
宮庄哲夫先生 中山善樹先生 退職記念論文集
訳:保井亮人
訳:保井亮人
Autor:
Akihito, Yasui
Publikováno v:
同志社哲學年報 = Doshisha Annual of Philosophy. 35:58-74
Autor:
Tetsuro Kawahara, Hiroaki Tada, Seishiro Ito, Mitsunobu Iwasaki, S. Karuppuchamy, Akihito Yasui
Publikováno v:
Journal of the Japan Society of Colour Material. 79:190-196
Anodization of aluminum plate followed by the electrodeposition of Ag or Au has yielded the metal nanorod-incorporated porous aluminum oxide film (NR/AO). This 2-step electrochemical method enabled us to arbitrarily control the aspect ratio of the na
Publikováno v:
Journal of Colloid and Interface Science. 293:443-448
Repeated electrodeposition of gold and silver on anodized aluminum plate yielded Au-Ag alternate nanowires in the geometrically anisotropic pores of the anodic oxidation films with mean diameter 10 nm and depth 10 mum, respectively. The absorption ma
Publikováno v:
Journal of the Japan Society of Colour Material. 79:55-61
Autor:
Mitsunobu Iwasaki, Toshikazu Kanoh, Hiroaki Tada, Tetsuro Kawahara, Subbian Karuppucharmy, Seishiro Ito, Akihito Yasui
Publikováno v:
Journal of The Surface Finishing Society of Japan. 57:670-675
AuAg alloy nanowires in the geometrically anisotropic pores of the aluminum anodic oxidation films with a mean diameter of 10nm and depth of 10μm were successfully prepared by the electrodeposition of gold and silver under the bath voltage of 6V AC
Publikováno v:
Journal of the Japan Society of Colour Material. 78:2-6
Publikováno v:
Japanese Journal of Applied Physics. 50:05EC08
The bald disappearance of barrier metal had been observed on the wafer after Cu chemical mechanical planarization (CMP) processing. It was speculated that this phenomenon occurs because the excessively oxidized Ta by electrochemical reaction with Cu