Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Akihiro NAKAZATO"'
Publikováno v:
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Vol 18, Iss 7, Pp JAMDSM0090-JAMDSM0090 (2024)
The gear skiving process involves a machining method wherein a skiving tool continuously machines a workpiece while rotating synchronously. This method proves to be efficient for machining internal gears, addressing challenges faced by conventional m
Externí odkaz:
https://doaj.org/article/c331c642549d4cc4b6e3c21fa5589c3a
Publikováno v:
経済研究所所報. 20:101-132
Publikováno v:
The Science of the total environment.
Although the production of compost from sewage sludge is well established in developed countries, the use of sludge-based compost may represent a source of pollutants. The present study assessed the levels of potentially harmful compounds in compost
Publikováno v:
Journal of Water and Environment Technology. 10:399-408
Autor:
Akihiro Nakazato, Tsutomu Endoh, Nanao Tsukamoto, Akio Tanaka, Shouhei Matsumoto, T. Tanaka, S. Roh, H. Gotoh, Y. Kumazawa, N. Teranishi, Minoru Hijikawa
Publikováno v:
Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
A 128 x 128 element bolometer infrared image sensor using thin film titanium is proposed. The device is a monolithically integrated structure having a titanium bolometer detector and a CMOS circuit underneath it for reading out the bolometer's signal
Autor:
Hideki Gotoh, Kuniyuki Okuyama, Kazuhiro Chiba, Yuuichi Kumazawa, Nanao Tsukamoto, Akihiro Nakazato, Minoru Hijikawa, T. Tanaka, Akio Tanaka, Shouhei Matsumoto, Tsutomu Endoh, Shigeyuki Itoh, Nobukazu Teranishi
Publikováno v:
SPIE Proceedings.
A 128 by 128 pixel bolometer infrared focal plane array using thin film titanium has been developed. The device is a monolithically integrated structure with a titanium bolometer detector located over a CMOS circuit that reads out the bolometer's sig
Autor:
Yuuichi Yamamoto, Akihiro Nakazato, Shouhei Matsumoto, Nobukazu Teranishi, Tsutomu Endoh, Nahoya Fujimoto, Shigeyuki Itoh, Akio Tanaka, Shigeru Tohyama, Makoto Uchida, Toshio Kanno, Nanao Tsukamoto, Susumu Murashima, Minoru Saga
Publikováno v:
SPIE Proceedings.
A 128 X 128 element thermopile infrared image sensor has been developed. This device has a monolithically integrated structure to increase fill factor. The CCD for signal charge accumulation and signal charge read-out is fabricated on the silicon sur
Akademický článek
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Conference
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