Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Ajay P. Giri"'
Publikováno v:
Insects, Vol 14, Iss 11, p 884 (2023)
In eastern North America, apple orchards are often attacked by several species of tortricid moths (Lepidoptera), including Cydia pomonella, Grapholita molesta, Argyrotaenia velutinana, and Pandemis limitata. Sex pheromones are routinely used to monit
Externí odkaz:
https://doaj.org/article/b2ba457b8854460189fbdac13d68969e
Autor:
Aasha Lamsal, Lalit P. Sah, Ajay P. Giri, Mukti Devkota, Luke A. Colavito, George Norton, Edwin George Rajotte, Rangaswamy Muniappan
Publikováno v:
Journal of the Plant Protection Society. 5:155-165
A study was carried out to document occurrence of Tuta absoluta and current management practices adopted by farmers in Lalitpur district (Lele VDC) where a total of 70 respondents were interviewed using random sampling method. The study comprises thr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5de550e45b1c3d79e28dc3da4c2301af
https://doi.org/10.3126/jpps.v5i0.47126
https://doi.org/10.3126/jpps.v5i0.47126
Autor:
Hai P. Longworth, M.P. Jeanneret, Eric D. Perfecto, John R. Pennacchia, R.R. Shields, Ajay P. Giri
Publikováno v:
IBM Journal of Research and Development. 42:597-606
A new generation of multilevel thin-film packages has been developed for IBM high-end S/390® and AS/400® systems. Thin-film structures in these packages are nonplanar and can be fabricated by either pattern electroplating or subtractive etching. Se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e71b118edd78b4fb78886d12f8b7c86a
https://doi.org/10.1147/rd.425.0597
https://doi.org/10.1147/rd.425.0597
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
Considerable work is ongoing worldwide on developing lead-free solutions for electronics industry to meet the needs of RoHs requirements. This paper describes the development and implementation of lead-free C4 interconnects for 300 mm wafers using, C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d20bf7e34236079b71d2908fd5b59dd
https://doi.org/10.1109/ectc.2007.373902
https://doi.org/10.1109/ectc.2007.373902
Publikováno v:
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
This paper describes development of high density single chip modules for flip chip (C4) area array interconnect such that the electrical, thermal, and reliability needs are met through an optimal tradeoff between system performance and module cost. P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1602b96541f3a6ec9f57df6a817b3ef
https://doi.org/10.1109/ectc.1998.678770
https://doi.org/10.1109/ectc.1998.678770