Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Ajay Malshe"'
Autor:
Mariah J. Nondorf, Madison Romanyk, Ronald P. Lemenager, Vishvesh Koranne, Ajay Malshe, Yuan H. Brad Kim
Publikováno v:
International Journal of Food Science & Technology. 57:6621-6632
Ageing population and new diseases are requiring the development of novel therapeutical strategies. 3D bioprinting an novel application domain of additive manufacturing emerged as a potential transformative strategy for tissue engineering and regener
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::64c37fedcdf5c2a24b8da61e69330dd9
https://lirias.kuleuven.be/handle/20.500.12942/711724
https://lirias.kuleuven.be/handle/20.500.12942/711724
Autor:
Ajay Malshe, Salil Bapat
Publikováno v:
2019 ASEE Annual Conference & Exposition Proceedings.
Publikováno v:
2020 ASEE Virtual Annual Conference Content Access Proceedings.
Autor:
Ajay Malshe
Publikováno v:
CIRP Encyclopedia of Production Engineering ISBN: 9783642359507
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25cc3b3e7caebbf93e484a59bbcee70c
https://doi.org/10.1007/978-3-642-35950-7_16731-1
https://doi.org/10.1007/978-3-642-35950-7_16731-1
Publikováno v:
JOM. 61:67-69
A high-strength coating for dental and orthopedic implants utilizing hydroxyapatite (HAp) nanoparticles provides for a high level of osseointegration through a range of surface pore sizes in the micro- to nanoscale. Zinc oxide (ZnO) nanoparticles may
Publikováno v:
Journal of Manufacturing Science and Engineering. 132
Autor:
David Barnett, Harshad Uka, James Guerrero, Brandon Arritt, Karim Qassim, Abhishek Singh, Ajay Malshe
Publikováno v:
Infotech@Aerospace.
Flexible circuits (copper clad polyimide) are an integral part of the majority of multifunctional structures. Multifunctional structures have been cited over recent years as an enabling techno logy for lightweight flight vehicles such as microspacecr
This grant are to simulate and fabricate an optimized micromachined microjet array (MJA) impingement cooling device for high power electronics. A chip-scale microjet impingement cooling device will also be implemented with heat source fabricated on i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4dbdb60f879b7db7c44b96d538be565
https://doi.org/10.21236/ada425124
https://doi.org/10.21236/ada425124