Zobrazeno 1 - 10
of 50
pro vyhledávání: '"Aisha Idris"'
Publikováno v:
Food ScienTech Journal, Vol 4, Iss 2, Pp 145-174 (2022)
Silver nanoparticles and/or nanoclay [particularly montmorillonite] are used in the majority of nanotechnology applications for food packaging. Other nanomaterials, on the other hand, can also be integrated into packaging. Metal oxide nanoparticles h
Externí odkaz:
https://doaj.org/article/f9216f52785b40909313045df9be6ae4
Publikováno v:
Turkish Journal of Agriculture: Food Science and Technology, Vol 11, Iss 6 (2023)
Perishable fresh vegetables that do not meet cosmetic standards and other crop waste rich resources are presently wasted. Mangifera indica leaves, Psidium guajava leaves, Petroselinum crispum leaves and Daucus carota were selected as model vegetables
Externí odkaz:
https://doaj.org/article/015ee08522ec4ccd9b0a0db608221241
Autor:
Zakiyyu Ibrahim Takai, Mohd Kamarulzaki Mustafa, Khairunnadim Ahmad Sekak, H.K. AbdulKadir, Saliza Asman, Aisha Idris, J. Mohammad
Publikováno v:
Arabian Journal of Chemistry, Vol 13, Iss 11, Pp 7978-7989 (2020)
This work presents a study of microwave absorption properties of PAni/Fe3O4/PVA nanofiber composites with different ratio of Fe3O4 nanoparticles. The morphology of the composites nanofibers study by Field Emission Scanning Electron Microscopes (FESEM
Externí odkaz:
https://doaj.org/article/90ca93b06b884e22815f4e5e0a6d55cd
Autor:
Zakiyyu Ibrahim Takai, Rajinder Singh Kaundal, Mohd Kamarulzaki Mustafa, Saliza Asman, Aisha Idris, Yusuf Shehu, Jibrin Mohammad, Miftahu Gambo Idris, Mansur Said
Publikováno v:
Materials Research, Vol 22, Iss 1 (2018)
Gamma ray shielding properties of borate glass samples containing oxides of lead and zinc are prepared by melt and quench technique and evaluated theoretically using XCOM computer software for gamma ray shielding properties. However, gamma ray shield
Externí odkaz:
https://doaj.org/article/ee72b3d6e5ed4df3a012647a93f84904
Publikováno v:
Soldering & Surface Mount Technology. 35:175-188
Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1d7af7beb4e1bc894434c2b62bdc788
https://doi.org/10.1108/ssmt-03-2022-0022
https://doi.org/10.1108/ssmt-03-2022-0022
Publikováno v:
Soldering & Surface Mount Technology.
Purpose Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most extensively used in the electronics industry. The Ag3Sn,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cae75610c2cde00576a50b7ed2707bf5
https://doi.org/10.1108/ssmt-08-2022-0054
https://doi.org/10.1108/ssmt-08-2022-0054
Akademický článek
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Autor:
Abdullah, Asyraf1 (AUTHOR) asyrafabdullah484@gmail.com, Aisha Idris, Siti Rabiatull1 (AUTHOR) rabiatull@ump.edu.my
Publikováno v:
Soldering & Surface Mount Technology. 2023, Vol. 35 Issue 3, p175-188. 14p.
Publikováno v:
International Journal of Psychosocial Rehabilitation. 24:2410-2417
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e15273a99ee08c6377398bde091ccb5c
https://doi.org/10.37200/ijpr/v24i2/pr200538
https://doi.org/10.37200/ijpr/v24i2/pr200538
Publikováno v:
Recent Progress in Lead-Free Solder Technology ISBN: 9783030934408
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7966e9f3c7564f506355742a9fb251f
https://doi.org/10.1007/978-3-030-93441-5_12
https://doi.org/10.1007/978-3-030-93441-5_12
