Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Aileen Soco"'
Autor:
Doogyu Lee, Jungmin Lee, Eunji Lee, Jeongjin Lee, Seung Yoon Lee, Chan Hwang, Pieter Kapel, Seung-Bin Yang, Mi-Yeon Baek, Jeroen Wefers Bettink, Se-Ra Jeon, Thomas Kim, Aileen Soco, Olger Zwier, Koen van Witteveen
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ad1127e0f7bc38e25c6b515cbc924a2
https://doi.org/10.1117/12.2627719
https://doi.org/10.1117/12.2627719
Autor:
Moosong Lee, Jinsun Kim, Dohyeon Park, Yeeun Han, Junseong Yoon, Seung Yoon Lee, Chan Hwang, Achim Woessner, Cyrus E. Tabery, Miao Wang, Antonio Corradi, Young-Hoon Song, Yun-A Sung, Thomas Kim, Aileen Soco, Jason Kim, Max Hsieh
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::011cce79672f0505f44ad038b57b7e30
https://doi.org/10.1117/12.2626721
https://doi.org/10.1117/12.2626721
Autor:
Jun-Yeob Kim, Dongyoung Lee, Sangjun Han, Aileen Soco, Nang-Lyeom Oh, Chanha Park, Tjitte Nooitgedagt, Dong-Hak Lee, Arno van Leest, Honggoo Lee, Jaap Karssenberg, Mir Shahrjerdy
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXIII.
In next generation 3D-NAND devices, accurately determining after-etch overlay for the multi-layer stack is a major challenge. This is especially the case for the multi-tier 3D-NAND structures, where the overlay of the channel holes is an important pe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f9f52b2fdc4cec90bd1e0ff7c1730fe
https://doi.org/10.1117/12.2515299
https://doi.org/10.1117/12.2515299
Autor:
Jae-Wuk Ju, Nang-Lyeom Oh, Hyun-Sok Kim, Young-Sik Kim, Giacomo Miceli, Paul Christiaan Hinnen, Jun-Hyung Lee, Aileen Soco, Paul Böcker, Moo-Young Seo, Yvon Chai, Elliott McNamara, Arno van Leest, Mir Shahrjerdy, Dong-Kiu Park, Jennifer Massier, Sang-Hoon Jung
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXXII.
This paper demonstrates the improvement using the YieldStar S-1250D small spot, high-NA, after-etch overlay in-device measurements in a DRAM HVM environment. It will be demonstrated that In-device metrology (IDM) captures after-etch device fingerprin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f811a20175b7c7430c2bfbd1ca20785
https://doi.org/10.1117/12.2297094
https://doi.org/10.1117/12.2297094
Autor:
Jon Wu, Hsieh Hung-Chih, Martin Ebert, Kai-Hsiung Chen, Aileen Soco, Pavel Izikson, Yong Ho Kim, Maxime d'Alfonso, Guo-Tsai Huang, Wei-Feng Ni, Aysegul Cumurcu Gysen, Shiuan-An Rao, Jeroen Ottens, Jacky Huang, Chih-Ming Ke, T. K. Chuang, Jenny Yueh, Tjitte Nooitgedagt, Shu-Chuan Chuang
Publikováno v:
SPIE Proceedings.
On-product overlay requirements are becoming more challenging with every next technology node due to the continued decrease of the device dimensions and process tolerances. Therefore, current and future technology nodes require demanding metrology ca
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e14053673cde7610f6c7ce93b3266442
https://doi.org/10.1117/12.2257894
https://doi.org/10.1117/12.2257894
Autor:
Hong-Goo Lee, Dong-Young Lee, Jun-Yeob Kim, Sang-Jun Han, Chan-Ha Park, Karssenberg, Jaap, Shahrjerdy, Mir, van Leest, Arno, Nang-Lyeom Oh, Dong-Hak Lee, Aileen Soco, Tjitte Nooitgedagt
Publikováno v:
Proceedings of SPIE; 1/22/2019, Vol. 10959, p1-8, 8p