Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ai Lin Ong"'
Publikováno v:
International Journal of Quality & Reliability Management. 17:259-275
Investigates the state of benchmarking in the manufacturing and service sectors of Singapore. Our aim is to understand the state of benchmarking in Singapore as well as the expectations and motivation of non‐benchmarking companies. Our approach to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a17dbed7f63e8dfba15daee45fed1ba
https://doi.org/10.1108/02656710010306157
https://doi.org/10.1108/02656710010306157
Autor:
Ai Lin Ong, Szu Shing Lim, Hwa Wei Chan, Choong Kooi Chee, E. Then, Shanggar Periaman, V.A. Rudge
Publikováno v:
53rd Electronic Components and Technology Conference, 2003. Proceedings..
This paper focuses on the molded underfill (MUF) technology for exposed die flip chip in the form of a molded matrix array package (FC-MMAP). Exposed die FC-MMAP in a strip form was built by placing a layer of compressible film between the die and mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ff2620f16c68da78dbb0e343e7997be
https://doi.org/10.1109/ectc.2003.1216407
https://doi.org/10.1109/ectc.2003.1216407
Autor:
Choong Kooi Chee, Szu Shing Lim, Rudge, V.A., Periaman, S., Ai Lin Ong, Hwa Wei Chan, Then, E.
Publikováno v:
Proceedings of the 53rd Electronic Components & Technology Conference, 2003; 2003, p962-970, 9p
Autor:
Brah, Shaukat A., Ai Lin Ong
Publikováno v:
International Journal of Quality & Reliability Management; 2000, Vol. 17 Issue 3, p259, 17p, 10 Charts