Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Ai, Kehua"'
Autor:
Wang, Rong, Chen, Shuyuan, Deng, Yi, Zeng, Xiangfei, Wang, Jiqin, Liang, Qian, Shu, Jiancheng, Wang, Mengmeng, Chen, Mengjun, Han, Junwei, Ai, Kehua
Publikováno v:
In Journal of Industrial and Engineering Chemistry 25 January 2024 129:511-520
Autor:
Meng, Weile, Ma, Zeyuan, Shu, Jiancheng, Li, Bing, Su, Pengxin, Wang, Rui, Chen, Mengjun, Liu, Zuohua, Ai, Kehua
Publikováno v:
In Separation and Purification Technology 15 January 2022 281
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
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K zobrazení výsledku je třeba se přihlásit.
Autor:
Lai, Zhiqiang, Wang, Shouxu, Wang, Chong, Hong, Yan, Chen, Yuanming, Zhang, Huaiwu, Zhou, Guoyun, He, Wei, Ai, Kehua, Peng, Yongqiang
Publikováno v:
In Electrochimica Acta 20 May 2018 273:318-326
Publikováno v:
Circuit World, 2018, Vol. 44, Issue 2, pp. 60-68.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/CW-06-2017-0029
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Guoyun Zhou, Zhengping Gao, Yukai Sun, Yuefeng Wang, Jianheng Song, Yan Hong, Rui Sun, Xinhai Wang, Ai Kehua, Wei He, Zhang Weihua, Li Qinghua
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:8165-8173
In this work, silver nitrate, thiourea, bisphenol A diglycidyl ether (BADGE), and propylene glycol methyl ether (PM) were selected for designing a silver(I)-complex to trigger the deposition of inductance coil on PET film through electroless copper p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60d5caae3f06ef540b3cdb0b22c863de
https://doi.org/10.1007/s10854-020-03289-8
https://doi.org/10.1007/s10854-020-03289-8
Autor:
Mengjun Chen, Zeyuan Ma, Pengxin Su, Zuohua Liu, Bing Li, Jiancheng Shu, Ai Kehua, Weile Meng, Rui Wang
Publikováno v:
Separation and Purification Technology. 281:119496
Phosphorus ore flotation tailings (POFTs) are solid wastes produced in the phosphorus flotation process, and most of the POFTs are directly discharged into the tailing yard without treatment. In this study, modified phosphorus ore flotation tailings
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9157d9f7e3e5bcbed517179925a4bb4f
https://doi.org/10.1016/j.seppur.2021.119496
https://doi.org/10.1016/j.seppur.2021.119496
Publikováno v:
Circuit World. 44:60-68
PurposeCopper electrodeposition acts as a crucial step in the manufacture of high-density interconnect board. The stability of plating solution and the uniformity of copper electrodeposit are the hotspot and difficulty for the research of electrodepo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3cc29700cbb6f974ef5e53c978ee1f6
https://doi.org/10.1108/cw-06-2017-0029
https://doi.org/10.1108/cw-06-2017-0029
Autor:
Chong Wang, Wei He, Ai Kehua, Guoyun Zhou, Yan Hong, Huaiwu Zhang, Shouxu Wang, Zhiqiang Lai, Yongqiang Peng, Yuanming Chen
Publikováno v:
Electrochimica Acta. 273:318-326
In this work, the leveling effect of two typical levelers for copper electroplating, Janus Green B (JGB) and polymerizates of imidazole and epichlorohydrin (IMEP) are both analyzed through computational calculations and electrochemical experiments. F
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0cbdcac9e1d63e7af26c4a21149a447
https://doi.org/10.1016/j.electacta.2018.04.062
https://doi.org/10.1016/j.electacta.2018.04.062