Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Ahuja, Nishi"'
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
With the accelerated application of cloud computing and artificial intelligence, the computing power and power consumption of chips are greatly enhanced, which brings severe challenges to heat dissipation. Based on this, Baidu has adopted advanced ph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ef9afc337d4083f2f093df1e14e37d6
https://doi.org/10.1115/ipack2021-69723
https://doi.org/10.1115/ipack2021-69723
Autor:
Jun Zhang, Jialiang Xu, Dayi Zhu, Bin Liu, Xiangyu Peng, Ahuja Nishi, Alex Zhou, Kunye Zhu, Jiajun Zhang, Xingxing Liu, Paul Sun, Ken Zhang, Hongmei Liu, Yongzhan He
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In recent years, Cloud Service has gradually been adopted by more and more end customers. Large amounts of applications from various businesses has been migrated to Cloud. Availability is one of the key considerations for end customers when adopting
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::41b2ca9b82ec6adc6010d6db7c0fe740
https://doi.org/10.1109/itherm45881.2020.9190321
https://doi.org/10.1109/itherm45881.2020.9190321
Autor:
Sun Xiaogang, Zhou Tianyu, Zhou Xiang, Khanna Rahul, Sun Yanbing, Zhang Lifei, Song Chuan, Ahuja Nishi, Daniel Abishai
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The complexity of management of modern datacenter is rapidly growing. It is emergent that the datacenter management system is able to automatically analyze datacenter status and provide intelligence for workload orchestration and infrastructure manag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5cdf6388d5061b2bc3fe85c08a2c197
https://doi.org/10.1109/itherm.2017.7992593
https://doi.org/10.1109/itherm.2017.7992593
Publikováno v:
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM); 2016, p171-177, 7p
Publikováno v:
2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM); 2016, p90-94, 5p
Publikováno v:
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM); 2015, p147-154, 8p
Publikováno v:
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM); 2015, p138-146, 9p
Autor:
He, Yongzhan, Chen, Guofeng, Wei, Liu, Qiujiang, Zhang, Jiajun, Zhou, Tianyu, Zhu, Pinyan, Zhu, Yongzhong, Liu, Chao, Ahuja, Nishi
Publikováno v:
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM); 2015, p120-126, 7p
Publikováno v:
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM); 2015, p25-30, 6p
Autor:
Shu Zhang, Tianyu Zhou, Ahuja, Nishi, Refai-Ahmed, Gamal, Yongzhong Zhu, Guofeng Chen, Zhihua Wang, Weiwei Song
Publikováno v:
Fourteenth Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2014, p1346-1353, 8p