Zobrazeno 1 - 10
of 101
pro vyhledávání: '"Ahmer Syed"'
Autor:
Tharani Ambreen, Parpio Yasmin, Farooq Salima, Ahmer Syed, Iqbal Saleem P, Khan Rashid AM, Zaman Mohammad
Publikováno v:
Substance Abuse Treatment, Prevention, and Policy, Vol 6, Iss 1, p 19 (2011)
Abstract Background There are hardly any studies carried out in Pakistan on the usage of benzodiazepines at the level of community. This research was aimed to determine the frequency of benzodiazepine use, along with its associations with socio-demog
Externí odkaz:
https://doaj.org/article/73b9f091568b4d86aebe9ca4660e3506
Autor:
Iqbal Saman, Bhutto Naila, Syed Ehsanullah, Ahmer Syed, Yousafzai Abdul, Siddiqi Mohammed, Zaman Mohammed
Publikováno v:
Annals of General Psychiatry, Vol 8, Iss 1, p 8 (2009)
Abstract Objective To investigate psychological well-being and substance abuse among medical students in Pakistan. Methods A cross-sectional questionnaire-based survey was conducted in six medical colleges across Pakistan. Final-year medical students
Externí odkaz:
https://doaj.org/article/4a1f867f5a3b40368073c5327892a2a7
Publikováno v:
Annals of General Psychiatry, Vol 7, Iss 1, p 12 (2008)
Abstract Background It has been known for a long time that use of antipsychotics, particularly atypical antipsychotics, is associated with weight gain and increase in risk of metabolic disturbances. In this study we have tried to find out if use of a
Externí odkaz:
https://doaj.org/article/735124e7b8444c63be36d7ac8d866278
Publikováno v:
BMC Psychiatry, Vol 7, Iss 1, p 59 (2007)
Abstract Background Researchers setting out to conduct research employing questionnaires in non-English speaking populations need instruments that have been validated in the indigenous languages. In this study we have tried to review the literature o
Externí odkaz:
https://doaj.org/article/7003ed37dc3d4be3a4a84821cc18c8c0
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Rapid growth of electronic devices and increased customer demands for high performance, low cost and miniaturized design has led to increased design complexities and several assembly and reliability issues. Increased customer demand, PCB-package syne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10f4da10e99d89af2230797a6a2cfd68
https://doi.org/10.1109/ectc32696.2021.00240
https://doi.org/10.1109/ectc32696.2021.00240
Autor:
Ahmer Syed, Mark Schwarz, Dongming He, Wei Zhao, Xuefeng Zhang, Lily Zhao, Wei Wang, Mark Nakamoto
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
With the increasing requirement for advanced technology nodes in high-performance devices, low-K (LK), ultralow-K (ULK) and extreme low K (ELK) dielectric materials have been integrated with copper pillar bumps in Back-End-of-Line (BEOL) interconnect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b8853bda1d55e28ca4938aac00fb355
https://doi.org/10.1109/ectc32862.2020.00048
https://doi.org/10.1109/ectc32862.2020.00048
Autor:
Ahmer Syed
Publikováno v:
International Symposium on Microelectronics. 2017:000001-000023
Changes in board technology, denser packaging due to board size limitations, and phone thickness trends pose number of technical challenges for designing IC packages for mobile applications. While thin packages are required to meet height constraints
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4a19e42b19d4e9ef1f5ed52aa3c1efb
https://doi.org/10.4071/isom-2017-slide-1
https://doi.org/10.4071/isom-2017-slide-1
Autor:
Riko Radojcic, Karthikeyan Dhandapani, Ahmer Syed, Ron Lindley, Wei Zhao, Mark Schwarz, Mark Nakamoto, Vidhya Ramachandran, Urmi Ray, Aurel Gunterus, Brian Matthew Henderson
Publikováno v:
International Symposium on Microelectronics. 2017:000325-000330
Electrical Chip Board Interaction (e-CBI) has emerged as a new risk in chip design as silicon die can directly interact with printed circuit board (PCB) in substrate-less wafer level packaging technology. To assess this risk Qualcomm Technologies, In
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e234c9e8cbe22c1074d3a9857fb3c1f
https://doi.org/10.4071/isom-2017-wp11_048
https://doi.org/10.4071/isom-2017-wp11_048
Autor:
Ahmer Syed, Xuefeng Zhang, Yangyang Sun, Wei Wang, Mark Schwarz, Bill Stone, Lily Zhao, Lejun Wang
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
As copper pillar bumps have been widely used in flip chip packages to meet the performance demand for denser IO bump and finer pitch, chip-package interaction (CPI) has been critical to achieving high yield rate and package reliability. With the incr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bfbeb9ea224ab3d2c80bd4a21c1bde09
https://doi.org/10.1109/ectc.2019.00066
https://doi.org/10.1109/ectc.2019.00066
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Mechanical simulation model is an effective way to analyze warpage of electronic packages. To establish a reliable numerical model, simulation results are usually calibrated by warpage measurement results. In general, the measured warpage data are co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6490bf5a80763aa6e21a6791eb9a934a
https://doi.org/10.1109/ectc.2019.00129
https://doi.org/10.1109/ectc.2019.00129