Výsledky vyhledávání - "Agyakwa, Pearl A."

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algor

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::773c3686615fff4e6669376ef8c21920
http://eprints.nottingham.ac.uk/33374/

Zobrazit plný text záznamu

Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement

Autor: Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl, Johnson, C. Mark

Transient thermal impedancemeasurement is commonly used to characterize the dynamic behaviour of the heat flowpath in power semiconductor packages. This can be used to derive a “structure function”which is a graphical representation of the intern

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::76e87d1dee96de7efd297dbf49124af1
https://nottingham-repository.worktribe.com/file/777641/1/1-s2.0-S0026271416300026-main.pdf

Zobrazit plný text záznamu

A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

Autor: Agyakwa, Pearl, Yang, Li, Corfield, Martin, Johnson, Christopher Mark

Publikováno v: IndraStra Global.

This paper concerns the non-destructive visualisation of the evolution of damage within ultrasonically bonded alumini-um wires using three dimensional x-ray computed tomography. We demonstrate the potential to observe the progressive accumulation of

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=issn23813652::ea0c5cd5bd2f0af4788591c0f9d2afa5
https://igi.indrastra.com/items/show/20690

Zobrazit plný text záznamu

Vyhledávací nástroje:

Upřesnit hledání