Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package.

Autor: Kaisare, A., Zhenxue Han, Agonager, D., Ramakrishna, K.

Publikováno v: ITherm 2002. Eighth Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258); 2002, p926-931, 6p