Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Ag-Cu solid solution nanoparticle"'
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 9123-9134 (2024)
In electronic packaging industry, it has been reported that compared with nano silver and nano copper, the complementation and coordination of Ag and Cu components enable bimetallic nanomaterials enhanced anti-electromigration and oxidation inhibitio
Externí odkaz:
https://doaj.org/article/52f40842a4554ceb826da76f78275966
Publikováno v:
In Journal of Materials Research and Technology November-December 2024 33:9123-9134