Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Aeni Jang"'
Autor:
Min-Ki Kim, Soojeoung Park, Aeni Jang, Hyuekjae Lee, Seungduk Baek, ChungSun Lee, Ilhwan Kim, Jumyong Park, Youngkun Jee, Un-Byoung Kang, Dae-Woo Kim
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3925321248206de1f5ff2df3bb046a31
https://doi.org/10.1109/ectc51906.2022.00062
https://doi.org/10.1109/ectc51906.2022.00062
Autor:
Sanghoon Lee, Youngkun Jee, Sangcheon Park, Soohwan Lee, Bohee Hwang, Gyeongjae Jo, Chungsun Lee, Jumyong Park, Aeni Jang, HyunChul Jung, Ilhwan Kim, Dongwoo Kang, Seungduk Baek, Dae-Woo Kim, Unbyung Kang
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ae512ae97a8d0aa95cd512db3fea492
https://doi.org/10.1109/ectc51906.2022.00175
https://doi.org/10.1109/ectc51906.2022.00175
Autor:
Aeni Jang, Sungwoo Park, Inhyo Hwang, Young-Lyong Kim, Su-Chang Lee, Soohyun Nam, Dae-Woo Kim
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Advanced package technology has been developed rapidly to meet a demand of the high end application such as AI and datacenter. 2.5D silicon interposer technology has been focused as the solution, for high end applications because of its heterogeneous
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::532a6d19636d01f9f7bdf228b05f8307
https://doi.org/10.1109/ectc32696.2021.00315
https://doi.org/10.1109/ectc32696.2021.00315