Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Adwait U. Telang"'
Autor:
Thomas R. Bieler, Adwait U. Telang
Publikováno v:
Journal of Electronic Materials. 38:2694-2701
The relative activity of the potential slip systems in Sn is examined by comparing an experiment of a single shear lap deformation with simulations using the viscoplastic self-consistent crystal plasticity model developed by Lebensohn and Tome. In a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b811731036ed69b8864ec5c5688cc95
https://doi.org/10.1007/s11664-009-0909-x
https://doi.org/10.1007/s11664-009-0909-x
Autor:
Thomas R. Bieler, Adwait U. Telang
Publikováno v:
Materials Science Forum. :1419-1424
Solder joints based on Sn-Ag used in electronic systems fail due to thermomechanical fatigue (TMF) damage that develops during service. Grain boundary sliding and/or shear band formation are observed during TMF. Orientation Imaging Microscopy (OIM) w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc6de9f199cfdfa48a41abb10c8a7b6b
https://doi.org/10.4028/www.scientific.net/msf.495-497.1419
https://doi.org/10.4028/www.scientific.net/msf.495-497.1419
Autor:
Adwait U. Telang, Thomas R. Bieler
Publikováno v:
Solid State Phenomena. 105:219-226
To investigate the effect of external loads arising from differential thermal expansion between a substrate and a surface mount component, specimens with a simulated surface mount component (nickel) on a copper substrate having a 1 mm2 joint area and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c29cb7c5ac5e87df9c5f4a7d6374598c
https://doi.org/10.4028/www.scientific.net/ssp.105.219
https://doi.org/10.4028/www.scientific.net/ssp.105.219
Autor:
K. N. Subramanian, L.P. Lehman, Adwait U. Telang, J. P. Lucas, Thomas R. Bieler, Eric J. Cotts, Y. Xing
Publikováno v:
Journal of Electronic Materials. 33:1412-1423
Grain-boundary deformation is the primary failure mode observed in solder joints. Understanding the effects of alloy composition variations and cooling rates on microstructural stability and deformation processes will allow development of improved jo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a125ea48efef462dda6f033a6974ab9
https://doi.org/10.1007/s11664-004-0081-2
https://doi.org/10.1007/s11664-004-0081-2
Publikováno v:
Journal of Electronic Materials. 32:1455-1462
Single shear-lap specimens having a solder joint area of 1 mm2 and nominally 100-µm thickness on copper substrates were crept at 85°C and compared to dual shear-lap specimens with copper and nickel interfaces that were thermomechanically cycled fro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ef5fbb81104fb4c0f7ed7e1b0d4d5efb
https://doi.org/10.1007/s11664-003-0115-1
https://doi.org/10.1007/s11664-003-0115-1
Publikováno v:
Journal of Electronic Materials. 31:1181-1189
To better understand the effect of repeated reverse stress in solder joints, a new testing method was developed. Tin-silver solder joints were fabricated, constrained between Cu blocks, and then subjected to repeated shear loading in a tensile tester
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e39a4c67c6c1781ce4f3112dab69da87
https://doi.org/10.1007/s11664-002-0008-8
https://doi.org/10.1007/s11664-002-0008-8
Publikováno v:
Journal of Electronic Materials. 31:1152-1159
Stresses that develop because of the coefficient of thermal expansion (CTE) mismatch between solder and substrate/components contribute to thermomechanical fatigue (TMF) of the solder joints. However, the relative importance of several processes that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdc790705755e6c4b801fdb23c8f9e86
https://doi.org/10.1007/s11664-002-0004-z
https://doi.org/10.1007/s11664-002-0004-z
