Zobrazeno 1 - 10
of 538
pro vyhledávání: '"Advanced packaging"'
Publikováno v:
Fundamental Research, Vol 4, Iss 6, Pp 1455-1458 (2024)
In the post-Moore era, advanced packaging is becoming more critical to meet the everlasting demands of electronic products with smaller size, more powerful performance and lower cost. In this paper, developments in advanced packaging have been discus
Externí odkaz:
https://doaj.org/article/acbabc01925544fc83f0a13691a20cd5
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 4522-4532 (2024)
Electromigration (EM) has been a pivotal reliability challenge for interconnects, but there are only few studies on EM in Cu–Cu joints. In this work, accelerated EM tests for the Cu–Cu joints were conducted at three temperatures (150 °C, 179 °C
Externí odkaz:
https://doaj.org/article/ffa7c935c348482c85bec8e62ba61f49
Publikováno v:
Journal of Materials Research and Technology, Vol 32, Iss , Pp 3490-3499 (2024)
Cu–Cu joints with various interfacial microstructures were fabricated, by applying different annealing conditions to the joints to trigger different amounts of recrystallization and grain growth at the bonding interfaces. Three distinct interfaces
Externí odkaz:
https://doaj.org/article/49506bd438a449688b742a09bb62a880
Publikováno v:
Journal of Materials Research and Technology, Vol 31, Iss , Pp 2994-3002 (2024)
Sn–Ag solders are widely used for advanced electronic packaging. The combined effect of Ag element and temperature gradient (TG) on the formation of Sn grains in Cu/Sn-xAg/Cu micro solder joints was elucidated systematically. Numerous small-sized
Externí odkaz:
https://doaj.org/article/a4e985773915444087eb9ec3687eb803
Publikováno v:
Soldering & Surface Mount Technology, 2023, Vol. 36, Issue 2, pp. 93-100.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-08-2023-0051
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 12, Pp 426-432 (2024)
For the autonomous driving application, data movement has increased rapidly between a CMOS Image sensor (CIS) and the processor due to increase in image resolution. Advanced packaging techniques like 2.5D/3D integration have been proposed to reduce t
Externí odkaz:
https://doaj.org/article/f51cdfe358af48d99f3db361a0b14654
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 12, Pp 96-103 (2024)
In advanced packaging schemes, such as fan-out integration technology, photosensitive polyimide (PSPI) is the key material to the fabrication of panel level redistribution-layer (RDL). However, a large mismatch of coefficient of thermal expansion (CT
Externí odkaz:
https://doaj.org/article/b2fecd3d8efb4b17813d3cc6743df56b
Publikováno v:
Heliyon, Vol 10, Iss 12, Pp e32530- (2024)
Cobalt has emerged as a vital material in 10 nm technology for localized interconnect layers, potentially offering a compelling alternative to Cu-based interconnects. In this study, we subjected the contamination arising from the presence of cobalt a
Externí odkaz:
https://doaj.org/article/07c764d93e8f4163a404c681f002c2e2
Publikováno v:
Micromachines, Vol 15, Iss 10, p 1211 (2024)
In the 5G era, the demand for high-bandwidth computing, transmission, and storage has led to the development of optoelectronic interconnect technology. This technology has evolved from traditional board-edge optical modules to smaller and more integr
Externí odkaz:
https://doaj.org/article/d0d8b174906141e28cce0204db9ece67
Autor:
Samran Khalid, Syed Ali Hassan, Hamza Javaid, Muqaddas Zahid, Muhammad Naeem, Zuhaib F. Bhat, Gholamreza Abdi, Rana Muhammad Aadil
Publikováno v:
Journal of Agriculture and Food Research, Vol 15, Iss , Pp 100962- (2024)
Tomatoes are cultivated and consumed in almost all countries of the world, highly valued for the abundance of nutritional compounds that contribute to their sweet-sour taste, widely appreciated globally. The unique taste of tomatoes is attributed to
Externí odkaz:
https://doaj.org/article/be4d6cfb8a984d4a826d242a1ded5393