Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Adriana Zambova"'
Autor:
Alexandre Beucher, Nicholas E. Powell, I. Kuzma-Filipek, Guy Beaucarne, Richard Russell, Adriana Zambova, Nicolas Zeghers, Don Wood, Pierre Chevalier, Jozef Szlufcik, Filip Duerinckx, Brian Chislea, Caroline Boulord
Publikováno v:
Energy Procedia. 67:101-107
We report the use of a screen-printable copper paste to form the front busbars on high efficiency photovoltaic cell structures in combination with copper fingers formed by light induced plating. Such a process route offers economic benefits relative
Autor:
Thibault Kervyn De Meerendre, Adriana Zambova, Ian Bennett, Kees Broek, Brian Chislea, Mario Kloos, John Albaugh, Jason Wei, Guy Beaucarne
Publikováno v:
Energy Procedia. 38:482-487
A new silicone-based Electrically Conductive Adhesive (ECA) has been developed for the Metal Wrap-Through module technology. The ECA has a Ag filler content below 60% but maintains a conductivity after curing below 1mOhmcm. It is flexible over a wide
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Thermal dissipation requirements for advanced flip chip devices are becoming significant. High end flip chip devices that used lidded packages are now being redesigned to utilize even more advanced materials. Devices that previously did not require a
Autor:
Hai P. Longworth, Yin Tang, Richard Langlois, Taryn J. Davis, Sushumna Iruvanti, Cassandra Hale, Lyndon Larson, Adriana Zambova
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
As flip chip packaging evolves, there are increasing demands on the overall package design in order to maintain reliability while the devices themselves are increasing in performance. A key aspect for advanced flip chip applications that require a he
Autor:
Jeremiah K. N. Mbindyo, Irena Kratochvílová, Theresa S. Mayer, Thomas E. Mallouk, Stanislav Záliš, Adriana Zambova
Publikováno v:
The European Physical Journal E. 18:201-206
Electric-field-assisted assembly has been used to place rod-shaped metal nanowires containing 4-[[2-nitro-4-(phenylethynyl) phenyl] ethynyl] benzenthiol molecules onto lithographically defined metal pads. These junctions exhibited negative differenti
Publikováno v:
Chemical Vapor Deposition. 9:26-33
Fabrication of dielectric nanotubes from silicon dioxide and silicon nitride by a template-based electron cyclotron resonance (ECR) plasma-enhanced (PE) CVD is described. The nanotubes synthesized from SiH 4 -O 2 and SiH 4 -N 2 binary source reagent
Autor:
Theresa S. Mayer, Adriana Zambova, Milan Kocirik, Thomas E. Mallouk, Jeremiah K. N. Mbindyo, Irena Kratochvílová
Publikováno v:
Journal of Materials Chemistry. 12:2927-2930
Electric-field assisted assembly has been used to place rod-shaped metal nanowires containing 4-{[2-nitro-4-(phenylethynyl)phenyl]ethynyl}benzenethiol molecules onto lithographically defined metal pads. In these systems the current–voltage characte
Autor:
Baharak Razavi, Jeremiah K. N. Mbindyo, Irena Kratochvílová, Adriana Zambova, Josef Holakovský
Publikováno v:
Scopus-Elsevier
An electric-field assisted assembly has been used to place rod-shaped, metal-organic, molecule-metal nanowires onto lithographically defined metal pads allowing the electrical characterization of metal-molecule self-assembled monolayer-metal containi
Autor:
Ian Bennett, Adriana Zambova, Brian Chislea, Jason Wei, Guy Beaucarne, Yanghai Yu, Kees Broek
We investigate the compatibility of silicone-based electrically conductive adhesives and different surface finishes of the conductive backsheet (CBS) used in MWT module assembly technology. We find that the same ECA can lead to dramatically different
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3579eb20d4246acb128a373810eace37
http://resolver.tudelft.nl/uuid:13606eaa-9276-472d-9621-0af8b6b4f548
http://resolver.tudelft.nl/uuid:13606eaa-9276-472d-9621-0af8b6b4f548
Autor:
Pierre Chevalier, I. Kuzma-Filipek, Nicholas E. Powell, Adriana Zambova, Alexandre Beucher, Filip Duerinckx, Jozef Szlufcik, Richard Russell, Don Wood, Pierre J. Verlinden, Brian Chislea, Caroline Boulord, Guy Beaucarne, Zhiqiang Feng, Weiwei Deng, Nicolas Zeghers
Publikováno v:
Energy Procedia. :724-732
A screen-printable copper paste has been developed by Dow Corning to replace the standard screen-printable silver paste for use in front busbars for solar cells. Solar cells produced with these ‘passivated copper busbars’ have shown increased con