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Autor:
Armin Hindel, Battist Rabay, Ellen Auerswald, Adrian Stelzer, Dan R. Wargulski, Dirk Busse, Mohamad Abo Ras, Jacek Rudzki, Markus Bast
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this work we show the capabilities of non-destructive testing by pulsed infrared thermography (PIRT) on large-area silver-sinter layers. This method can achieve a similar reliability in detecting delamination as SAM and X-ray analysis. The great a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd5b970a2a0c2807984a5e1d9cd4e0d2
https://doi.org/10.23919/empc44848.2019.8951861
https://doi.org/10.23919/empc44848.2019.8951861
