Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Adrian Pietruszka"'
Publikováno v:
Journal of Materials Research and Technology, Vol 22, Iss , Pp 403-412 (2023)
The effect of SiC nano-phases (nano-particles and nano-fibers) addition into SAC0307 solder paste was investigated on the thermal and microstructural properties of the composite solder joints. The nano-phases were used between 0.125 and 1 wt%, and th
Externí odkaz:
https://doaj.org/article/205239e9ba634300a76013c2c8ab1d7e
Publikováno v:
Applied Sciences, Vol 11, Iss 12, p 5583 (2021)
The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 mm, covered with a 35 μm thick Cu layer, were used. A surface finis
Externí odkaz:
https://doaj.org/article/133aef58b9474f808bb9b14ccfc64f97
Autor:
Adrian Pietruszka
Publikováno v:
PRZEGLĄD ELEKTROTECHNICZNY. 1:96-100
Publikováno v:
Applied Sciences, Vol 11, Iss 5583, p 5583 (2021)
Applied Sciences
Volume 11
Issue 12
Applied Sciences
Volume 11
Issue 12
The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 mm, covered with a 35 μm thick Cu layer, were used. A surface finis