Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Adri van der Waal"'
Autor:
V. Simons, Adri van der Waal, Stian Martinsen, Maaike M. Visser Taklo, Ingrid De Wolf, Adriana Lapadatu, Bernhard Wunderle, Astrid-Sofie B. Vardoy, H. J. van de Wiel
Publikováno v:
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, 16 July 2013 through 18 July 2013, Burlingame, CA
The level of stress in silicon as a result of applying Cu-Sn SLID wafer level bonding to hermetically encapsulate a highperformance infrared bolometer device was studied. Transistors are present in the read out integrated circuit (ROIC) of the device
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3d9b2d72d97d7747172db861a78338c8
http://resolver.tudelft.nl/uuid:bfe70d7a-239d-4ab9-8de8-26cae1237a7a
http://resolver.tudelft.nl/uuid:bfe70d7a-239d-4ab9-8de8-26cae1237a7a
Publikováno v:
Journal of Light and Visual Environment, 3, 35, 214-221
Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cb82ab5c1b1d56c71d9cdcdacb7533aa
http://resolver.tudelft.nl/uuid:2bdc7c7d-b1a2-45d3-8584-41c89d679935
http://resolver.tudelft.nl/uuid:2bdc7c7d-b1a2-45d3-8584-41c89d679935