Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Adren Hsieh"'
Publikováno v:
International Symposium on Microelectronics. 2015:000245-000250
Smart phones & other portable devices have dominated Semiconductor growth, and drive IC packages smaller, lighter & thinner, and they continue to integrate more functions in that smaller volume. Besides SOC solutions driven by design houses or system
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c7d89dada6d239c564d8c85b7a34ac4
https://doi.org/10.4071/isom-2015-wa33
https://doi.org/10.4071/isom-2015-wa33
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000545-000566
Nearly half a century ago the first die bumping was developed by IBM that would later enable what we call Wafer Level Packaging. It took nearly 40 years for Wafer Level Chip Scale Packaging (WLCSP), with all of the “packaging” done while still in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e610f19608778a94b9474e13f4d0cf34
https://doi.org/10.4071/2014dpc-ta24
https://doi.org/10.4071/2014dpc-ta24
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In conclusion, FOCoS is successfully developed for advanced SiP. FOCoS is aimed to a large package size and high I/O density (> 1000 I/Os) for high-end application. The existing fan-out and flip-chip techniques provide FOCoS with a short time to mark
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e3fd7bf032f7c1a49d2d1e5f30cd75b
https://doi.org/10.1109/impact.2015.7365240
https://doi.org/10.1109/impact.2015.7365240
Autor:
Archer Pai, T.L. Yang, Shao-Yu Wang, Yaochen Wang, Chiyu Wang, Cheng-Tang Pan, Bo-Sheng Wang, Adren Hsieh, Chen-Chih Chiu
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
This study investigates of the mechanical properties of wafer level chip scale package (WLCSP) without under bump metallurgy (UBM) layer which is defined as 3-mask WLCSP package. The mechanical properties of dielectric layer, such as Young's modulus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b2826c60678bd21fcdcb16599dbc591
https://doi.org/10.1109/impact.2015.7365228
https://doi.org/10.1109/impact.2015.7365228
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Portable electronics have become ubiquitous tools for everyday living, with increasing semiconductor density required for the expanding functionality expected in each generation by consumers. This requires that the semiconductors in these devices hav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74c171185d1703c59ce4208dd10424f5
https://doi.org/10.1109/estc.2012.6542154
https://doi.org/10.1109/estc.2012.6542154
Autor:
Homing Tong, Ker-Chang Hsieh, Simon Su, Tom Tai, Adren Hsieh, Jui-I Yu, Rick Yu, Walter Jau, Danial Huang
Publikováno v:
2006 International Microsystems, Package, Assembly Conference Taiwan.
Wafer bumping is growing in importance with the increasing used of Flip Chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b999c1e768858c582634099b587b2c2e
https://doi.org/10.1109/impact.2006.312207
https://doi.org/10.1109/impact.2006.312207