Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Aditya Vikram Singh"'
Publikováno v:
Sustainable Marketing and Customer Value ISBN: 9781003173311
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d138baed3e880750d884659429875ad
https://doi.org/10.4324/9781003173311-8
https://doi.org/10.4324/9781003173311-8
Publikováno v:
Latest Advances in Diagnosis and Treatment of Women-Associated Cancers ISBN: 9781003260172
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08941428c17f7ef33d42d40610caa2f7
https://doi.org/10.1201/9781003260172-9
https://doi.org/10.1201/9781003260172-9
Publikováno v:
2022 Interdisciplinary Research in Technology and Management (IRTM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66119773aee4d0fe815b1a638fc270ef
https://doi.org/10.1109/irtm54583.2022.9791804
https://doi.org/10.1109/irtm54583.2022.9791804
Publikováno v:
Annals of Pathology and Laboratory Medicine. 6:C100-103
Medullary carcinoma of the breast is an uncommon variant of invasive ductal carcinoma, which constitutes nearly 5% of all breast cancers in men and women. These tumours are often associated with favourable prognosis despite showing aggressive behavio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::18f343e2d8be3d537d2e63a87588d114
https://doi.org/10.21276/apalm.2620
https://doi.org/10.21276/apalm.2620
Publikováno v:
Indian Journal of Pathology: Research and Practice. 8:661-665
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c98419c82d3263cddb0a79c9f42b702
https://doi.org/10.21088/ijprp.2278.148x.8519.22
https://doi.org/10.21088/ijprp.2278.148x.8519.22
Autor:
Swati Sahay, Aditya Vikram Singh
Publikováno v:
Indian Journal of Pathology: Research and Practice. 8:697-701
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11d530e80120aea8ffdcd9cdafc6efcf
https://doi.org/10.21088/ijprp.2278.148x.8519.28
https://doi.org/10.21088/ijprp.2278.148x.8519.28
Publikováno v:
Indian Journal of Pathology: Research and Practice. 8:189-194
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd24e3fb348770ae838eb367aa348c45
https://doi.org/10.21088/ijprp.2278.148x.8219.10
https://doi.org/10.21088/ijprp.2278.148x.8219.10
Publikováno v:
International Journal of Innovative Research in Computer and Communication Engineering. :4985-4993
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa04da87dd71f8830ac0decb200a5a56
https://doi.org/10.15680/ijircce.2015.0306006
https://doi.org/10.15680/ijircce.2015.0306006
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
The paper examines the power dissipation patterns of different TSV interconnect configurations which could be employed in 3D IC. 1-TSV, 2-TSV, 3-TSV (straight line configuration, triangular configuration) and 6-TSV (rectangular configuration, hexagon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9477e3cfe38096557d649bb9b0afed5
https://doi.org/10.1109/ectc.2013.6575913
https://doi.org/10.1109/ectc.2013.6575913