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pro vyhledávání: '"Adan, O. C.G."'
Autor:
Herrmann, A., Erich, S. J.F., van der Ven, L. G.J., Huinink, H. P., van Driel, W.D., van Soestbergen, M., Mavinkurve, A., De Buyl, F., Fischer, H. R., Mol, J.M.C., Adan, O. C.G.
Publikováno v:
Microelectronics Reliability, 134:114550. Elsevier
Microelectronics Reliability, 134
Microelectronics Reliability, 134
Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from environmental influences, with one of these influences being moisture ingress, causing corrosion. To obtain the needed thermal and mechanical properties EMCs require a high
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::604182d9a1a268ff6d37033bd9a8a286
https://research.tue.nl/en/publications/6c75a72c-33d8-4712-b8d3-ce3209a8a94b
https://research.tue.nl/en/publications/6c75a72c-33d8-4712-b8d3-ce3209a8a94b
Publikováno v:
Macromolecules; Feb2012, Vol. 45 Issue 4, p1937-1945, 9p